Multi nozzle electrohydrodynamic inkjet printing head by batch fabrication

K. I. Lee, B. Lim, H. Lee, Sung Hyun Kim, C. S. Lee, J. W. Cho, S. Chung, Y. Hong

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

Abstract

We report a multi nozzle electrohydrodynamic (EHD) printing head by using batch fabrication for the first time. Inks can be ejected from a glass nozzle by applied large electric field. Tiny nozzles with a outer diameter of 100 microns are fabricated by sand blasting on a glass wafer. A stable continuous jetting with a commercial carbon black ink was observed. Continuous lines with a width of 30 microns on a silicon wafer were printed simultaneously with a DC bias voltage of 1.7 kV at the stage speed of 500 mm/s. Separated dot patterns with a diameter of 20 microns were printed with various jetting frequency up to 10 kHz on a super-hydropobic teflon coated silicon wafer. Also continuous line width can be reduced to 20 microns on a hydrophobic surface.

Original languageEnglish
Title of host publicationProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
Pages1165-1168
Number of pages4
DOIs
Publication statusPublished - 2013 Apr 2
Externally publishedYes
EventIEEE 26th International Conference on Micro Electro Mechanical Systems, MEMS 2013 - Taipei, Taiwan, Province of China
Duration: 2013 Jan 202013 Jan 24

Other

OtherIEEE 26th International Conference on Micro Electro Mechanical Systems, MEMS 2013
CountryTaiwan, Province of China
CityTaipei
Period13/1/2013/1/24

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Mechanical Engineering
  • Condensed Matter Physics
  • Electronic, Optical and Magnetic Materials

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  • Cite this

    Lee, K. I., Lim, B., Lee, H., Kim, S. H., Lee, C. S., Cho, J. W., Chung, S., & Hong, Y. (2013). Multi nozzle electrohydrodynamic inkjet printing head by batch fabrication. In Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS) (pp. 1165-1168). [6474458] https://doi.org/10.1109/MEMSYS.2013.6474458