Multi-step cure process for void-free silicone resin encapsulant

Min Jae Song, Kwon Hee Kim, Gil Sang Yoon, Heung Kyu Kim

Research output: Contribution to journalArticlepeer-review

1 Citation (Scopus)

Abstract

In general, rapid cure reaction for LED encapsulant silicone resin causes serious defects in the cured resin product such as warpage, residual void, and decreasing wetablility. In order to remove residual voids in a silicone resin, multi-step cure processes were tested in the present investigation. Three kinds of multi-step cure processes were applied and residual voids were observed. Experimental observation showed that most of the voids were removed under 70 °C which is the minimum temperature for activating chemical cure reaction. In addition, degree of cure (DOC) and temperature distribution were predicted by using FEM analysis of heat transfer. It was concluded that cure temperature of the DOC smaller than 0.5~0.6 is an effective way to minimize the residual void and stress.

Original languageEnglish
Pages (from-to)126-131
Number of pages6
JournalAdvanced Science Letters
Volume13
DOIs
Publication statusPublished - 2012 Jun

Keywords

  • Encapsulant
  • LED
  • Multi-step cure process
  • Silicone resin
  • Void

ASJC Scopus subject areas

  • Computer Science(all)
  • Health(social science)
  • Mathematics(all)
  • Education
  • Environmental Science(all)
  • Engineering(all)
  • Energy(all)

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