New current-mode sense amplifiers for high density DRAM and PIM architectures

S. M. Yo, C. Kim, S. O. Jung, K. H. Baek, S. M. Kang

Research output: Contribution to journalConference articlepeer-review

Abstract

This paper describes new current-mode sense amplifiers for high density DRAM and PIM architectures. New dynamic-load latch-type and hybrid-type current-mode amplifiers are proposed and evaluated in terms of delay, power-delay product and energy-delay product for aluminum and copper interconnects.

Original languageEnglish
Pages (from-to)IV938-IV941
JournalMaterials Research Society Symposium - Proceedings
Volume626
Publication statusPublished - 2001
Externally publishedYes
EventThermoelectric Materials 2000-The Next Generation Materials for Small-Scale Refrigeration and Power Generation Applications - San Francisco, CA, United States
Duration: 2000 Apr 242000 Apr 27

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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