New plasma display panel packaging technology using electrostatic bonding method

Duck Jung Lee; Jin Wook Jeong; Young Cho Kim; Yun Hi Lee; Byeong Kwon Ju; Tae Seung Cho; Eun Ha Choi; Jin Jang

doi:10.1116/1.1387461

New plasma display panel packaging technology using electrostatic bonding method

Duck Jung Lee, Jin Wook Jeong, Young Cho Kim, Yun Hi Lee, Byeong Kwon Ju, Tae Seung Cho, Eun Ha Choi, Jin Jang

Department of Physics

Research output: Contribution to journal › Conference article › peer-review

3 Citations (Scopus)

Abstract

The glass-to-glass electrostatic bonding using the ITO and amorphous silicon layer was developed for the plasma display panel (PDP) package. The bonding was successfully performed at 180°C with 250 V_dc. From the XPS results, the surface's silicon consumed some portion of Si into Si-O during the electrostatic bonding process at the interface. The vacuum level of the panel was maintained continuously for 160 hr. The light emission was observed successfully from the packaged 3.6 in. ac-PDP with 8 mm thickness by this method.

Original language	English
Pages (from-to)	1381-1384
Number of pages	4
Journal	Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Volume	19
Issue number	4
DOIs	https://doi.org/10.1116/1.1387461
Publication status	Published - 2001 Jul
Event	19th North American Conference on Molecular Beam Epitaxy (NAMBE-19) - Tempe, AZ, United States Duration: 2000 Oct 15 → 2000 Oct 18

ASJC Scopus subject areas

Condensed Matter Physics
Electrical and Electronic Engineering

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title = "New plasma display panel packaging technology using electrostatic bonding method",

abstract = "The glass-to-glass electrostatic bonding using the ITO and amorphous silicon layer was developed for the plasma display panel (PDP) package. The bonding was successfully performed at 180°C with 250 Vdc. From the XPS results, the surface's silicon consumed some portion of Si into Si-O during the electrostatic bonding process at the interface. The vacuum level of the panel was maintained continuously for 160 hr. The light emission was observed successfully from the packaged 3.6 in. ac-PDP with 8 mm thickness by this method.",

author = "Lee, {Duck Jung} and Jeong, {Jin Wook} and Kim, {Young Cho} and Lee, {Yun Hi} and Ju, {Byeong Kwon} and Cho, {Tae Seung} and Choi, {Eun Ha} and Jin Jang",

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TY - JOUR

T1 - New plasma display panel packaging technology using electrostatic bonding method

AU - Lee, Duck Jung

AU - Jeong, Jin Wook

AU - Kim, Young Cho

AU - Lee, Yun Hi

AU - Ju, Byeong Kwon

AU - Cho, Tae Seung

AU - Choi, Eun Ha

AU - Jang, Jin

PY - 2001/7

Y1 - 2001/7

N2 - The glass-to-glass electrostatic bonding using the ITO and amorphous silicon layer was developed for the plasma display panel (PDP) package. The bonding was successfully performed at 180°C with 250 Vdc. From the XPS results, the surface's silicon consumed some portion of Si into Si-O during the electrostatic bonding process at the interface. The vacuum level of the panel was maintained continuously for 160 hr. The light emission was observed successfully from the packaged 3.6 in. ac-PDP with 8 mm thickness by this method.

AB - The glass-to-glass electrostatic bonding using the ITO and amorphous silicon layer was developed for the plasma display panel (PDP) package. The bonding was successfully performed at 180°C with 250 Vdc. From the XPS results, the surface's silicon consumed some portion of Si into Si-O during the electrostatic bonding process at the interface. The vacuum level of the panel was maintained continuously for 160 hr. The light emission was observed successfully from the packaged 3.6 in. ac-PDP with 8 mm thickness by this method.

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M3 - Conference article

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SN - 1071-1023

VL - 19

SP - 1381

EP - 1384

JO - Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

JF - Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

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T2 - 19th North American Conference on Molecular Beam Epitaxy (NAMBE-19)

Y2 - 15 October 2000 through 18 October 2000

ER -

New plasma display panel packaging technology using electrostatic bonding method

Abstract

ASJC Scopus subject areas

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