New plasma display panel packaging technology using electrostatic bonding method

Duck Jung Lee, Jin Wook Jeong, Young Cho Kim, Yun Hi Lee, Byeong Kwon Ju, Tae Seung Cho, Eun Ha Choi, Jin Jang

Research output: Contribution to journalConference article

2 Citations (Scopus)

Abstract

The glass-to-glass electrostatic bonding using the ITO and amorphous silicon layer was developed for the plasma display panel (PDP) package. The bonding was successfully performed at 180°C with 250 Vdc. From the XPS results, the surface's silicon consumed some portion of Si into Si-O during the electrostatic bonding process at the interface. The vacuum level of the panel was maintained continuously for 160 hr. The light emission was observed successfully from the packaged 3.6 in. ac-PDP with 8 mm thickness by this method.

Original languageEnglish
Pages (from-to)1381-1384
Number of pages4
JournalJournal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Volume19
Issue number4
DOIs
Publication statusPublished - 2001 Jul
Event19th North American Conference on Molecular Beam Epitaxy (NAMBE-19) - Tempe, AZ, United States
Duration: 2000 Oct 152000 Oct 18

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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