New Radio Technologies for Ultra Reliable and Low Latency Communications

Hyoungju Ji, Wonjun Kim, Byonghyo Shim

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

Ultra reliable and low latency communications (URLLC) is a new use case in 5G wireless systems to accommodate emerging mission-critical services and applications. These include driverless vehicles and drone-based deliveries, smart cities and factories, remote medical diagnosis and surgery, and artificial intelligence-based personalized assistants. In order to support URLLC, there should be changes in the air interface (a.k.a. physical-layer). In this article, we provide physical layer challenges and solutions in 5G URLLC downlink. We discuss requirements of URLLC and then present the physical layer issues and new solutions including data structure, multiplexing schemes, and reliability assurance technologies, which have been adopted in the 5G new radio (NR).

Original languageEnglish
Title of host publicationProceedings of TENCON 2018 - 2018 IEEE Region 10 Conference
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1620-1623
Number of pages4
ISBN (Electronic)9781538654576
DOIs
Publication statusPublished - 2019 Feb 22
Event2018 IEEE Region 10 Conference, TENCON 2018 - Jeju, Korea, Republic of
Duration: 2018 Oct 282018 Oct 31

Publication series

NameIEEE Region 10 Annual International Conference, Proceedings/TENCON
Volume2018-October
ISSN (Print)2159-3442
ISSN (Electronic)2159-3450

Conference

Conference2018 IEEE Region 10 Conference, TENCON 2018
CountryKorea, Republic of
CityJeju
Period18/10/2818/10/31

ASJC Scopus subject areas

  • Computer Science Applications
  • Electrical and Electronic Engineering

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  • Cite this

    Ji, H., Kim, W., & Shim, B. (2019). New Radio Technologies for Ultra Reliable and Low Latency Communications. In Proceedings of TENCON 2018 - 2018 IEEE Region 10 Conference (pp. 1620-1623). [8650159] (IEEE Region 10 Annual International Conference, Proceedings/TENCON; Vol. 2018-October). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/TENCON.2018.8650159