New vacuum packaging method of field emission display

B. K. Ju, W. B. Choi, S. J. Jeong, N. Y. Lee, J. I. Han, K. I. Cho, M. H. Oh

Research output: Contribution to journalConference article

Abstract

Two ITO-coated glass wafers are successfully bonded by the typical Si-Pyrex electrostatic bonding mechanism. Both Si-#7740 and Ti-(Li-doped SiO 2) interlayer systems can be employed for the electrostatic bonding of #7059-#7059 and #0080-#0080 glass wafer pairs. This glass-to-glass electrostatic bonding process can be applied to the clean and tubeless packaging of field emission display panels.

Original languageEnglish
Pages (from-to)246-252
Number of pages7
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume3242
DOIs
Publication statusPublished - 1997
Externally publishedYes
EventSmart Electronics and MEMS - Adelaide, SA, Australia
Duration: 1997 Dec 111997 Dec 11

Keywords

  • Electrostatic bonding
  • FED packaging
  • Glass-to-glass bonding
  • Interlayer

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

Fingerprint Dive into the research topics of 'New vacuum packaging method of field emission display'. Together they form a unique fingerprint.

Cite this