New vacuum packaging method of field emission display

Byeong Kwon Ju, W. B. Choi, S. J. Jeong, N. Y. Lee, J. I. Han, K. I. Cho, M. H. Oh

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Two ITO-coated glass wafers are successfully bonded by the typical Si-Pyrex electrostatic bonding mechanism. Both Si-#7740 and Ti-(Li-doped SiO 2) interlayer systems can be employed for the electrostatic bonding of #7059-#7059 and #0080-#0080 glass wafer pairs. This glass-to-glass electrostatic bonding process can be applied to the clean and tubeless packaging of field emission display panels.

Original languageEnglish
Title of host publicationProceedings of SPIE - The International Society for Optical Engineering
Pages246-252
Number of pages7
Volume3242
DOIs
Publication statusPublished - 1997
Externally publishedYes
EventSmart Electronics and MEMS - Adelaide, SA, Australia
Duration: 1997 Dec 111997 Dec 11

Other

OtherSmart Electronics and MEMS
CountryAustralia
CityAdelaide, SA
Period97/12/1197/12/11

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Keywords

  • Electrostatic bonding
  • FED packaging
  • Glass-to-glass bonding
  • Interlayer

ASJC Scopus subject areas

  • Applied Mathematics
  • Computer Science Applications
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics

Cite this

Ju, B. K., Choi, W. B., Jeong, S. J., Lee, N. Y., Han, J. I., Cho, K. I., & Oh, M. H. (1997). New vacuum packaging method of field emission display. In Proceedings of SPIE - The International Society for Optical Engineering (Vol. 3242, pp. 246-252) https://doi.org/10.1117/12.293566