Nickel-copper hybrid electrodes self-adhered onto a silicon wafer by supersonic cold-spray

Jong Gun Lee, Do Yeon Kim, Byungjun Kang, Donghwan Kim, Hee Eun Song, Jooyoung Kim, Woonsuk Jung, Dukhaeng Lee, Salem S. Al-Deyab, Scott C. James, Suk Goo Yoon

Research output: Contribution to journalArticle

17 Citations (Scopus)

Abstract

Abstract High-performance electrodes are fabricated through supersonic spraying of nickel and copper particles. These electrodes yield low specific resistivities, comparable to electrodes produced by screen-printed silver paste and light-induced plating. The appeal of this fabrication method is the low cost of copper and large area scalability of supersonic spray-coating techniques. The copper and nickel electrode was fabricated in the open air without any pre- or post-treatment. The spray-coated copper-nickel electrode was characterized by optical microscopy, scanning electron microscopy (SEM), transmission electron microscopy (TEM), X-ray diffraction, and energy dispersive spectroscopy. Although both SEM and TEM images confirmed voids trapped between flattened particles in the fabricated electrode, this electrode's resistivity was order 10<sup>-6</sup> Ω cm, which is comparable to the bulk value for pure copper.

Original languageEnglish
Article number12077
Pages (from-to)156-163
Number of pages8
JournalActa Materialia
Volume93
DOIs
Publication statusPublished - 2015 Apr 1

Fingerprint

Nickel
Silicon wafers
Copper
Electrodes
Transmission electron microscopy
Scanning electron microscopy
Coating techniques
Spraying
Ointments
Silver
Plating
Optical microscopy
Scalability
Energy dispersive spectroscopy
Fabrication
X ray diffraction
Air
Costs

Keywords

  • Contact resistivity
  • Nickel-copper electrode
  • Silicon solar cell
  • Specific resistivity
  • Supersonic cold spraying

ASJC Scopus subject areas

  • Ceramics and Composites
  • Metals and Alloys
  • Polymers and Plastics
  • Electronic, Optical and Magnetic Materials

Cite this

Nickel-copper hybrid electrodes self-adhered onto a silicon wafer by supersonic cold-spray. / Lee, Jong Gun; Kim, Do Yeon; Kang, Byungjun; Kim, Donghwan; Song, Hee Eun; Kim, Jooyoung; Jung, Woonsuk; Lee, Dukhaeng; Al-Deyab, Salem S.; James, Scott C.; Yoon, Suk Goo.

In: Acta Materialia, Vol. 93, 12077, 01.04.2015, p. 156-163.

Research output: Contribution to journalArticle

Lee, JG, Kim, DY, Kang, B, Kim, D, Song, HE, Kim, J, Jung, W, Lee, D, Al-Deyab, SS, James, SC & Yoon, SG 2015, 'Nickel-copper hybrid electrodes self-adhered onto a silicon wafer by supersonic cold-spray', Acta Materialia, vol. 93, 12077, pp. 156-163. https://doi.org/10.1016/j.actamat.2015.04.012
Lee, Jong Gun ; Kim, Do Yeon ; Kang, Byungjun ; Kim, Donghwan ; Song, Hee Eun ; Kim, Jooyoung ; Jung, Woonsuk ; Lee, Dukhaeng ; Al-Deyab, Salem S. ; James, Scott C. ; Yoon, Suk Goo. / Nickel-copper hybrid electrodes self-adhered onto a silicon wafer by supersonic cold-spray. In: Acta Materialia. 2015 ; Vol. 93. pp. 156-163.
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AB - Abstract High-performance electrodes are fabricated through supersonic spraying of nickel and copper particles. These electrodes yield low specific resistivities, comparable to electrodes produced by screen-printed silver paste and light-induced plating. The appeal of this fabrication method is the low cost of copper and large area scalability of supersonic spray-coating techniques. The copper and nickel electrode was fabricated in the open air without any pre- or post-treatment. The spray-coated copper-nickel electrode was characterized by optical microscopy, scanning electron microscopy (SEM), transmission electron microscopy (TEM), X-ray diffraction, and energy dispersive spectroscopy. Although both SEM and TEM images confirmed voids trapped between flattened particles in the fabricated electrode, this electrode's resistivity was order 10-6 Ω cm, which is comparable to the bulk value for pure copper.

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