Novel bonding technology for hermetically sealed silicon micropackage

Duck Jung Lee, Byeong Kwon Ju, Woo Beom Choi, Jee Won Jeong, Yun Hi Lee, Jin Jang, Kwang Bae Lee, O. H. Myung-Hwan

Research output: Contribution to journalArticlepeer-review

8 Citations (Scopus)

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Engineering & Materials Science

Physics & Astronomy