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Novel bonding technology for hermetically sealed silicon micropackage
Duck Jung Lee, Byeong Kwon Ju, Woo Beom Choi, Jee Won Jeong, Yun Hi Lee, Jin Jang, Kwang Bae Lee, O. H. Myung-Hwan
Research output: Contribution to journal › Article › peer-review
8
Citations
(Scopus)