Nucleation and morphology of Cu6Sn5 intermetallic at the interface between molten Sn-0.7Cu-0.2Cr solder and Cu substrate

Junhyuk Son, Dong Yurl Yu, Min Su Kim, Yong Ho Ko, Dong Jin Byun, Junghwan Bang

Research output: Contribution to journal › Article › peer-review

1 Citation (Scopus)

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Engineering & Materials Science

Chemical Compounds