Numerical and experimental investigation on thermal characteristics of deformable thin film mirrors package and its performance optimization

Jae Choon Kim, Jin Taek Chung, Jae Hong Min, Dong Jin Lee, Ji Hyuk Yu, Ju Hwan Lim, Byeong Kwon Ju, Sung Woo Hwang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper presents the thermal characteristics of a micro-electro- mechanical deformable thin film mirrors package for the optical modulators used in mobile equipment such as cellphones, lab tops and PDA. One critical factor which affects the performance of the package is the ambient temperature change. To reduce the effect of the ambient temperature change, the temperature control system by a micro heater and a temperature feedback circuit was developed. The thermal characteristics histories were numerically modeled, the results of which were validated by the experimental data. The magnitude of the fluctuation was reduced within 1 C under the controlled system. In addition, required time to reach the steady state temperature was reduced by using the proposed control system.

Original languageEnglish
Title of host publication2008 Proceedings of the ASME Summer Heat Transfer Conference, HT 2008
Pages663-669
Number of pages7
Volume2
Publication statusPublished - 2009 Sep 21
Event2008 ASME Summer Heat Transfer Conference, HT 2008 - Jacksonville, FL, United States
Duration: 2008 Aug 102008 Aug 14

Other

Other2008 ASME Summer Heat Transfer Conference, HT 2008
CountryUnited States
CityJacksonville, FL
Period08/8/1008/8/14

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ASJC Scopus subject areas

  • Fluid Flow and Transfer Processes
  • Mechanical Engineering

Cite this

Kim, J. C., Chung, J. T., Min, J. H., Lee, D. J., Yu, J. H., Lim, J. H., ... Hwang, S. W. (2009). Numerical and experimental investigation on thermal characteristics of deformable thin film mirrors package and its performance optimization. In 2008 Proceedings of the ASME Summer Heat Transfer Conference, HT 2008 (Vol. 2, pp. 663-669)