Numerical simulation and thermal failure analysis of SOM package

Jae Choon Kim, Jin Taek Chung, Won Suk Lee, Gyoung Bum Kim, Dong Jin Lee, Ji Man Cho, Ji Hyuk Yu, Byeong Kwon Ju, SungWoo Hang, Heung Woo Park, Sang Kyeong Yun

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

This paper presents a numerical analysis and experimental study on failure of the spatial optical modulators (SOM) package and its preventing from thermal damage. The SOM package has been developed for projection displays. Most heat sources of the SOM package were mounted on a glass plane that was coated with SiO2 and TiO2 for optical performance. The heat sources were distributed by entering the laser beam to the operating mirror, heating of IC chip and ohmic heating in the circuit of glass plane. In designing the SOM package, it is important to consider the thermal influence to the SOM package's performance and reliability, In this study, the electrical and thermal simulation by CFD and experiments using infrared camera are carried out for the enhancement of thermal reliability. The results are in good agreement with the experiments results and the maximum temperature of glass plane was decreased by the change of glass plane structure change.

Original languageEnglish
Title of host publicationEuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007
DOIs
Publication statusPublished - 2007 Nov 27
EventEuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007 - London, United Kingdom
Duration: 2007 Apr 162007 Apr 18

Other

OtherEuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007
CountryUnited Kingdom
CityLondon
Period07/4/1607/4/18

Fingerprint

failure analysis
Light modulators
Failure analysis
modulators
Computer simulation
glass
Glass
heat sources
simulation
thermal simulation
heating
charge flow devices
Joule heating
numerical analysis
projection
Laser beams
cameras
chips
Hot Temperature
Numerical analysis

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Surfaces, Coatings and Films
  • Condensed Matter Physics

Cite this

Kim, J. C., Chung, J. T., Lee, W. S., Kim, G. B., Lee, D. J., Cho, J. M., ... Yun, S. K. (2007). Numerical simulation and thermal failure analysis of SOM package. In EuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007 [4201155] https://doi.org/10.1109/ESIME.2007.359958

Numerical simulation and thermal failure analysis of SOM package. / Kim, Jae Choon; Chung, Jin Taek; Lee, Won Suk; Kim, Gyoung Bum; Lee, Dong Jin; Cho, Ji Man; Yu, Ji Hyuk; Ju, Byeong Kwon; Hang, SungWoo; Park, Heung Woo; Yun, Sang Kyeong.

EuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007. 2007. 4201155.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Kim, JC, Chung, JT, Lee, WS, Kim, GB, Lee, DJ, Cho, JM, Yu, JH, Ju, BK, Hang, S, Park, HW & Yun, SK 2007, Numerical simulation and thermal failure analysis of SOM package. in EuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007., 4201155, EuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007, London, United Kingdom, 07/4/16. https://doi.org/10.1109/ESIME.2007.359958
Kim JC, Chung JT, Lee WS, Kim GB, Lee DJ, Cho JM et al. Numerical simulation and thermal failure analysis of SOM package. In EuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007. 2007. 4201155 https://doi.org/10.1109/ESIME.2007.359958
Kim, Jae Choon ; Chung, Jin Taek ; Lee, Won Suk ; Kim, Gyoung Bum ; Lee, Dong Jin ; Cho, Ji Man ; Yu, Ji Hyuk ; Ju, Byeong Kwon ; Hang, SungWoo ; Park, Heung Woo ; Yun, Sang Kyeong. / Numerical simulation and thermal failure analysis of SOM package. EuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007. 2007.
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abstract = "This paper presents a numerical analysis and experimental study on failure of the spatial optical modulators (SOM) package and its preventing from thermal damage. The SOM package has been developed for projection displays. Most heat sources of the SOM package were mounted on a glass plane that was coated with SiO2 and TiO2 for optical performance. The heat sources were distributed by entering the laser beam to the operating mirror, heating of IC chip and ohmic heating in the circuit of glass plane. In designing the SOM package, it is important to consider the thermal influence to the SOM package's performance and reliability, In this study, the electrical and thermal simulation by CFD and experiments using infrared camera are carried out for the enhancement of thermal reliability. The results are in good agreement with the experiments results and the maximum temperature of glass plane was decreased by the change of glass plane structure change.",
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AU - Cho, Ji Man

AU - Yu, Ji Hyuk

AU - Ju, Byeong Kwon

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AB - This paper presents a numerical analysis and experimental study on failure of the spatial optical modulators (SOM) package and its preventing from thermal damage. The SOM package has been developed for projection displays. Most heat sources of the SOM package were mounted on a glass plane that was coated with SiO2 and TiO2 for optical performance. The heat sources were distributed by entering the laser beam to the operating mirror, heating of IC chip and ohmic heating in the circuit of glass plane. In designing the SOM package, it is important to consider the thermal influence to the SOM package's performance and reliability, In this study, the electrical and thermal simulation by CFD and experiments using infrared camera are carried out for the enhancement of thermal reliability. The results are in good agreement with the experiments results and the maximum temperature of glass plane was decreased by the change of glass plane structure change.

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