Numerical simulation and thermal failure analysis of SOM package

Jae Choon Kim, Jin Taek Chung, Won Suk Lee, Gyoung Bum Kim, Dong Jin Lee, Ji Man Cho, Ji Hyuk Yu, Byeong Kwon Ju, Sung Woo Hang, Heung Woo Park, Sang Kyeong Yun

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

This paper presents a numerical analysis and experimental study on failure of the spatial optical modulators (SOM) package and its preventing from thermal damage. The SOM package has been developed for projection displays. Most heat sources of the SOM package were mounted on a glass plane that was coated with SiO2 and TiO2 for optical performance. The heat sources were distributed by entering the laser beam to the operating mirror, heating of IC chip and ohmic heating in the circuit of glass plane. In designing the SOM package, it is important to consider the thermal influence to the SOM package's performance and reliability, In this study, the electrical and thermal simulation by CFD and experiments using infrared camera are carried out for the enhancement of thermal reliability. The results are in good agreement with the experiments results and the maximum temperature of glass plane was decreased by the change of glass plane structure change.

Original languageEnglish
Title of host publicationEuroSime 2007
Subtitle of host publicationInternational Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007
PublisherIEEE Computer Society
ISBN (Print)1424411068, 9781424411061
DOIs
Publication statusPublished - 2007
EventEuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007 - London, United Kingdom
Duration: 2007 Apr 162007 Apr 18

Publication series

NameEuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007

Other

OtherEuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007
CountryUnited Kingdom
CityLondon
Period07/4/1607/4/18

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Surfaces, Coatings and Films
  • Condensed Matter Physics

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