Numerical simulation and thermal failure analysis of SOM package

Jae Choon Kim, Jin Taek Chung, Won Suk Lee, Gyoung Bum Kim, Dong Jin Lee, Ji Man Cho, Ji Hyuk Yu, Byeong Kwon Ju, Sung Woo Hang, Heung Woo Park, Sang Kyeong Yun

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

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Chemical Compounds

Physics & Astronomy

Engineering & Materials Science