On-demand Mobile CPU Cooling with Thin-Film Thermoelectric Array

Hammam Kattan, Sung Woo Chung, Jorg Henkel, Hussam Amrouch

Research output: Contribution to journalArticlepeer-review

Abstract

On-demand cooling is inevitable to maximize the processor's performance, while fulfilling thermal constraints - this holds more in advanced technologies, where localized hot spots changes during run-time. In this work, we propose to adopt an array of thin-film thermoelectric (TE) devices, that is integrated within the chip packaging, for both cooling and energy-harvesting purposes. Each TE device within the array can be during run-time enabled either for energy harvesting or on-demand cooling. Our approach is implemented and evaluated using mature Finite Elements Analysis tool in which a commercial multi-core mobile chip is modeled after careful calibrations together with state-of-the-art TE devices. Results demonstrate that our approach reduces the peak temperature by up to 24 °C and the average temperature by 10 °C across various benchmarks with the cost of 67.5 mW. Additionally, the harvested energy from the array of TE devices compensates for 89 % of the required cooling energy

Original languageEnglish
JournalIEEE Micro
DOIs
Publication statusAccepted/In press - 2021

Keywords

  • Benchmark testing
  • Cooling
  • Energy harvesting
  • Graphics processing units
  • Heating systems
  • Mobile devices
  • Semiconductor device measurement
  • System-on-chip
  • Temperature measurement
  • Thermal management
  • Thermoelectric

ASJC Scopus subject areas

  • Software
  • Hardware and Architecture
  • Electrical and Electronic Engineering

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