Optimal iterative learning control of wafer temperature uniformity in rapid thermal processing

Kwang S. Lee, Hyojin Ahn, In Sik Chin, Jay H. Lee, Dae Ryook Yang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

An optimal iterative learning control (ILC) technique based on a quadratic optimal criterion has been implemented and evaluated in an experimental rapid thermal processing (RTP) system fabricating 8-inch silicon wafers. The control technique is based on a time-varying linear state space model which approximates a nonlinear system along a reference trajectory. This ILC control technique is capable of making improvements in the control performance from one run to next and eventually converges to a minimum achievable tracking error despite model error. Through a series of experiments with wafers on which thermocouples are glued, it was observed that the wafer temperatures are steered to the reference trajectory reducing the differences overcoming various disturbances.

Original languageEnglish
Title of host publicationIFAC Proceedings Volumes (IFAC-PapersOnline)
PublisherIFAC Secretariat
Pages333-338
Number of pages6
Volume15
Edition1
Publication statusPublished - 2002
Event15th World Congress of the International Federation of Automatic Control, 2002 - Barcelona, Spain
Duration: 2002 Jul 212002 Jul 26

Other

Other15th World Congress of the International Federation of Automatic Control, 2002
CountrySpain
CityBarcelona
Period02/7/2102/7/26

Keywords

  • Identification
  • Iterative learning control
  • LQG
  • Rapid thermal processing
  • Time-varying linear state space model

ASJC Scopus subject areas

  • Control and Systems Engineering

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  • Cite this

    Lee, K. S., Ahn, H., Chin, I. S., Lee, J. H., & Yang, D. R. (2002). Optimal iterative learning control of wafer temperature uniformity in rapid thermal processing. In IFAC Proceedings Volumes (IFAC-PapersOnline) (1 ed., Vol. 15, pp. 333-338). IFAC Secretariat.