Optimization of hybrid ink formulation and ipl sintering process for ink-jet 3d printing

Jae Young Lee, Cheong Soo Choi, Kwang Taek Hwang, Kyu Sung Han, Jin Ho Kim, Sahn Nahm, Bum Seok Kim

Research output: Contribution to journalArticlepeer-review

Abstract

Ink-jet 3D printing technology facilitates the use of various materials of ink on each ink-jet head and simultaneous printing of multiple materials. It is suitable for manufacturing to process a complex multifunctional structure such as sensors and printed circuit boards. In this study, a complex structure of a SiO2 insulation layer and a conductive Cu layer was fabricated with photo-curable nano SiO2 ink and Intense Pulsed Light (IPL)-sinterable Cu nano ink using multi-material ink-jet 3D printing technology. A precise photo-cured SiO2 insulation layer was designed by optimizing the operating conditions and the ink rheological properties, and the resistance of the insulation layer was 2.43 × 1013 Ω·cm. On the photo-cured SiO2 insulation layer, a Cu conductive layer was printed by controlling droplet distance. The sintering of the IPL-sinterable nano Cu ink was performed using an IPL sintering process, and electrical and mechanical properties were confirmed according to the annealing temperature and applied voltage. Then, Cu conductive layer was annealed at 100 C to remove the solvent, and IPL sintered at 700 V. The Cu conductive layer of the complex structure had an electrical property of 29 µΩ·cm and an adhesive property with SiO2 insulation layer of 5B.

Original languageEnglish
Article number1295
JournalNanomaterials
Volume11
Issue number5
DOIs
Publication statusPublished - 2021 May

Keywords

  • IPL sintering
  • IPL-sinterable nano Cu ink
  • Ink-jet 3D printing
  • Photo-curable nano SiO ink
  • Rheological properties

ASJC Scopus subject areas

  • Chemical Engineering(all)
  • Materials Science(all)

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