Optimization of InGaN-based LED Package Structure for Automotive Adaptive Driving Beam Headlamp

Ho Young Kim, Min Su Kim, Kwang Hee Lee, Kyoung Mo Kang, Jeong Tak Oh, Hwan Hee Jeong, Tae Yeon Seong

Research output: Contribution to journalArticle

Abstract

We investigated the luminance, thermal, and thermo-mechanical properties of vertical (V)-LED and flip-chip (FC)-LED packages with different white silicones for a vehicle head lamp application. The FC-LED package showed higher equivalent maximum stress than the V-LED package. For example, the equivalent maximum stresses for the FC-LED package with white silicone (WR-3020) were 6.05 and 2.45 MPa at -45 and 125 C, respectively, whereas those for the V-LED one with WR-3001 were 1.09 and 1.56 MPa. Irrespective of currents, the V-LED packages exhibited lower thermal resistance (Rth) than the FC-LED package. The V-LED package showed 25.3% lower Rth value (junction to PCB) at 1000 mA than the FC-LED package. The FC-LED packages illustrated higher luminous flux drop-rate at 85 C than the V-LED package. The V-LED packages revealed lower surface temperature than the FC-LED package. The contrast ratio depended on the package structures and white silicone coating widths. The packages with the wider edge-coating width had higher luminance and the V-LED packages exhibited higher luminance. The luminous flux maintenance rate was degraded by 0.9%-2.9% after 1000 h. The V-LED package with WR-3001 showed the best performance, while the FC-LED package with WR-3020 displayed the lowest performance.

Original languageEnglish
Article number055017
JournalECS Journal of Solid State Science and Technology
Volume9
Issue number5
DOIs
Publication statusPublished - 2020 Jan 6

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials

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