Packaging of the RF-MEMS switch

Heung Woo Park, Yun Kwon Park, Duck Jung Lee, Byeong Kwon Ju

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

In this work, the flip-chip method was used for packaging of the RF-MEMS switch on the quartz substrate with low losses. The 4-inch Pyrex glass was used as a package substrate and it was punched with airblast with 250μm diameter holes. The Cr/Au seed layer was deposited on it and the vias were filled with plating gold. After forming the molds on the holes with thick photoresist, the bumps were plated on holes. The package substrate was bonded with the quartz substrate with the B-stage epoxy. The loss of the overall package structure was tested with a network analyzer and was within -0.05 dB. This structure can be used for wafer level packaging of not only the RF-MEMS devices but also the MEMS devices.

Original languageEnglish
Title of host publicationProceedings of SPIE - The International Society for Optical Engineering
EditorsP.D. Franzon, A.P. Malshe, F.E.H. Tay
Pages234-243
Number of pages10
Volume4593
DOIs
Publication statusPublished - 2001
Externally publishedYes
EventDesign, Chararacterization, and Packaging for MEMS and Microelectronics II - Adelaide, Australia
Duration: 2001 Dec 172001 Dec 19

Other

OtherDesign, Chararacterization, and Packaging for MEMS and Microelectronics II
CountryAustralia
CityAdelaide
Period01/12/1701/12/19

Fingerprint

packaging
microelectromechanical systems
MEMS
Packaging
switches
Switches
Substrates
Quartz
quartz
Gold plating
Electric network analyzers
Molds
borosilicate glass
Photoresists
plating
photoresists
Seed
seeds
analyzers
chips

Keywords

  • B-stage epoxy
  • Bump
  • Flip-chip
  • RF-MEMS
  • Switch
  • Vertical feed-through
  • Wafer-level packaging

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Condensed Matter Physics

Cite this

Park, H. W., Park, Y. K., Lee, D. J., & Ju, B. K. (2001). Packaging of the RF-MEMS switch. In P. D. Franzon, A. P. Malshe, & F. E. H. Tay (Eds.), Proceedings of SPIE - The International Society for Optical Engineering (Vol. 4593, pp. 234-243) https://doi.org/10.1117/12.448864

Packaging of the RF-MEMS switch. / Park, Heung Woo; Park, Yun Kwon; Lee, Duck Jung; Ju, Byeong Kwon.

Proceedings of SPIE - The International Society for Optical Engineering. ed. / P.D. Franzon; A.P. Malshe; F.E.H. Tay. Vol. 4593 2001. p. 234-243.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Park, HW, Park, YK, Lee, DJ & Ju, BK 2001, Packaging of the RF-MEMS switch. in PD Franzon, AP Malshe & FEH Tay (eds), Proceedings of SPIE - The International Society for Optical Engineering. vol. 4593, pp. 234-243, Design, Chararacterization, and Packaging for MEMS and Microelectronics II, Adelaide, Australia, 01/12/17. https://doi.org/10.1117/12.448864
Park HW, Park YK, Lee DJ, Ju BK. Packaging of the RF-MEMS switch. In Franzon PD, Malshe AP, Tay FEH, editors, Proceedings of SPIE - The International Society for Optical Engineering. Vol. 4593. 2001. p. 234-243 https://doi.org/10.1117/12.448864
Park, Heung Woo ; Park, Yun Kwon ; Lee, Duck Jung ; Ju, Byeong Kwon. / Packaging of the RF-MEMS switch. Proceedings of SPIE - The International Society for Optical Engineering. editor / P.D. Franzon ; A.P. Malshe ; F.E.H. Tay. Vol. 4593 2001. pp. 234-243
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