PDP tubeless packaging using B-stage epoxy

Seung Il Moon, Duck Jung Lee, Myung Hwan Oh, Yun-Hi Lee, Byeong Kwon Ju, Young Cho Kim, Gwon Jin Moon, Jun Dong Kim

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this paper, the AC-PDP was packaged with a newly developed tubeless packaging method using a B-stage epoxy. This method was performed at low temperature less than 200°C in He-Ne(27%)-Xe(3%) gas ambient. The PDP was successfully packaged and fully emitted. Also, the driving properties on operating time were investigated.

Original languageEnglish
Title of host publicationSID Conference Record of the International Display Research Conference
Pages961-964
Number of pages4
Publication statusPublished - 2001
Externally publishedYes
EventAsia Display/IDW 2001 - Nagoya, Japan
Duration: 2002 Oct 162002 Oct 19

Other

OtherAsia Display/IDW 2001
CountryJapan
CityNagoya
Period02/10/1602/10/19

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ASJC Scopus subject areas

  • Engineering(all)

Cite this

Moon, S. I., Lee, D. J., Oh, M. H., Lee, Y-H., Ju, B. K., Kim, Y. C., Moon, G. J., & Kim, J. D. (2001). PDP tubeless packaging using B-stage epoxy. In SID Conference Record of the International Display Research Conference (pp. 961-964)