PDP tubeless packaging using B-stage epoxy

Seung Il Moon, Duck Jung Lee, Myung Hwan Oh, Yun-Hi Lee, Byeong Kwon Ju, Young Cho Kim, Gwon Jin Moon, Jun Dong Kim

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this paper, the AC-PDP was packaged with a newly developed tubeless packaging method using a B-stage epoxy. This method was performed at low temperature less than 200°C in He-Ne(27%)-Xe(3%) gas ambient. The PDP was successfully packaged and fully emitted. Also, the driving properties on operating time were investigated.

Original languageEnglish
Title of host publicationSID Conference Record of the International Display Research Conference
Pages961-964
Number of pages4
Publication statusPublished - 2001
Externally publishedYes
EventAsia Display/IDW 2001 - Nagoya, Japan
Duration: 2002 Oct 162002 Oct 19

Other

OtherAsia Display/IDW 2001
CountryJapan
CityNagoya
Period02/10/1602/10/19

Fingerprint

Packaging
Gases
Temperature

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Moon, S. I., Lee, D. J., Oh, M. H., Lee, Y-H., Ju, B. K., Kim, Y. C., ... Kim, J. D. (2001). PDP tubeless packaging using B-stage epoxy. In SID Conference Record of the International Display Research Conference (pp. 961-964)

PDP tubeless packaging using B-stage epoxy. / Moon, Seung Il; Lee, Duck Jung; Oh, Myung Hwan; Lee, Yun-Hi; Ju, Byeong Kwon; Kim, Young Cho; Moon, Gwon Jin; Kim, Jun Dong.

SID Conference Record of the International Display Research Conference. 2001. p. 961-964.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Moon, SI, Lee, DJ, Oh, MH, Lee, Y-H, Ju, BK, Kim, YC, Moon, GJ & Kim, JD 2001, PDP tubeless packaging using B-stage epoxy. in SID Conference Record of the International Display Research Conference. pp. 961-964, Asia Display/IDW 2001, Nagoya, Japan, 02/10/16.
Moon SI, Lee DJ, Oh MH, Lee Y-H, Ju BK, Kim YC et al. PDP tubeless packaging using B-stage epoxy. In SID Conference Record of the International Display Research Conference. 2001. p. 961-964
Moon, Seung Il ; Lee, Duck Jung ; Oh, Myung Hwan ; Lee, Yun-Hi ; Ju, Byeong Kwon ; Kim, Young Cho ; Moon, Gwon Jin ; Kim, Jun Dong. / PDP tubeless packaging using B-stage epoxy. SID Conference Record of the International Display Research Conference. 2001. pp. 961-964
@inproceedings{bead7616a4ec4e90abfc27edde6c3673,
title = "PDP tubeless packaging using B-stage epoxy",
abstract = "In this paper, the AC-PDP was packaged with a newly developed tubeless packaging method using a B-stage epoxy. This method was performed at low temperature less than 200°C in He-Ne(27{\%})-Xe(3{\%}) gas ambient. The PDP was successfully packaged and fully emitted. Also, the driving properties on operating time were investigated.",
author = "Moon, {Seung Il} and Lee, {Duck Jung} and Oh, {Myung Hwan} and Yun-Hi Lee and Ju, {Byeong Kwon} and Kim, {Young Cho} and Moon, {Gwon Jin} and Kim, {Jun Dong}",
year = "2001",
language = "English",
pages = "961--964",
booktitle = "SID Conference Record of the International Display Research Conference",

}

TY - GEN

T1 - PDP tubeless packaging using B-stage epoxy

AU - Moon, Seung Il

AU - Lee, Duck Jung

AU - Oh, Myung Hwan

AU - Lee, Yun-Hi

AU - Ju, Byeong Kwon

AU - Kim, Young Cho

AU - Moon, Gwon Jin

AU - Kim, Jun Dong

PY - 2001

Y1 - 2001

N2 - In this paper, the AC-PDP was packaged with a newly developed tubeless packaging method using a B-stage epoxy. This method was performed at low temperature less than 200°C in He-Ne(27%)-Xe(3%) gas ambient. The PDP was successfully packaged and fully emitted. Also, the driving properties on operating time were investigated.

AB - In this paper, the AC-PDP was packaged with a newly developed tubeless packaging method using a B-stage epoxy. This method was performed at low temperature less than 200°C in He-Ne(27%)-Xe(3%) gas ambient. The PDP was successfully packaged and fully emitted. Also, the driving properties on operating time were investigated.

UR - http://www.scopus.com/inward/record.url?scp=0035782964&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0035782964&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:0035782964

SP - 961

EP - 964

BT - SID Conference Record of the International Display Research Conference

ER -