PDP tubeless packaging using B-stage epoxy

Seung Il Moon, Duck Jung Lee, Myung Hwan Oh, Yun Hi Lee, Byeong Kwon Ju, Young Cho Kim, Gwon Jin Moon, Jun Dong Kim

Research output: Contribution to journalConference articlepeer-review

Abstract

In this paper, the AC-PDP was packaged with a newly developed tubeless packaging method using a B-stage epoxy. This method was performed at low temperature less than 200°C in He-Ne(27%)-Xe(3%) gas ambient. The PDP was successfully packaged and fully emitted. Also, the driving properties on operating time were investigated.

Original languageEnglish
Pages (from-to)961-964
Number of pages4
JournalSID Conference Record of the International Display Research Conference
Publication statusPublished - 2001
EventAsia Display/IDW 2001 - Nagoya, Japan
Duration: 2002 Oct 162002 Oct 19

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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