PDP tubeless packaging using B-stage epoxy

Seung Il Moon; Duck Jung Lee; Myung Hwan Oh; Yun Hi Lee; Byeong Kwon Ju; Young Cho Kim; Gwon Jin Moon; Jun Dong Kim

PDP tubeless packaging using B-stage epoxy

Seung Il Moon, Duck Jung Lee, Myung Hwan Oh, Yun Hi Lee, Byeong Kwon Ju, Young Cho Kim, Gwon Jin Moon, Jun Dong Kim

Department of Physics

Research output: Contribution to journal › Conference article › peer-review

Abstract

In this paper, the AC-PDP was packaged with a newly developed tubeless packaging method using a B-stage epoxy. This method was performed at low temperature less than 200°C in He-Ne(27%)-Xe(3%) gas ambient. The PDP was successfully packaged and fully emitted. Also, the driving properties on operating time were investigated.

Original language	English
Pages (from-to)	961-964
Number of pages	4
Journal	SID Conference Record of the International Display Research Conference
Publication status	Published - 2001
Event	Asia Display/IDW 2001 - Nagoya, Japan Duration: 2002 Oct 16 → 2002 Oct 19

ASJC Scopus subject areas

Electrical and Electronic Engineering

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title = "PDP tubeless packaging using B-stage epoxy",

abstract = "In this paper, the AC-PDP was packaged with a newly developed tubeless packaging method using a B-stage epoxy. This method was performed at low temperature less than 200°C in He-Ne(27%)-Xe(3%) gas ambient. The PDP was successfully packaged and fully emitted. Also, the driving properties on operating time were investigated.",

author = "Moon, {Seung Il} and Lee, {Duck Jung} and Oh, {Myung Hwan} and Lee, {Yun Hi} and Ju, {Byeong Kwon} and Kim, {Young Cho} and Moon, {Gwon Jin} and Kim, {Jun Dong}",

year = "2001",

language = "English",

pages = "961--964",

journal = "SID Conference Record of the International Display Research Conference",

issn = "1083-1312",

publisher = "Society for Information Display",

note = "Asia Display/IDW 2001 ; Conference date: 16-10-2002 Through 19-10-2002",

}

TY - JOUR

T1 - PDP tubeless packaging using B-stage epoxy

AU - Moon, Seung Il

AU - Lee, Duck Jung

AU - Oh, Myung Hwan

AU - Lee, Yun Hi

AU - Ju, Byeong Kwon

AU - Kim, Young Cho

AU - Moon, Gwon Jin

AU - Kim, Jun Dong

PY - 2001

Y1 - 2001

N2 - In this paper, the AC-PDP was packaged with a newly developed tubeless packaging method using a B-stage epoxy. This method was performed at low temperature less than 200°C in He-Ne(27%)-Xe(3%) gas ambient. The PDP was successfully packaged and fully emitted. Also, the driving properties on operating time were investigated.

AB - In this paper, the AC-PDP was packaged with a newly developed tubeless packaging method using a B-stage epoxy. This method was performed at low temperature less than 200°C in He-Ne(27%)-Xe(3%) gas ambient. The PDP was successfully packaged and fully emitted. Also, the driving properties on operating time were investigated.

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UR - http://www.scopus.com/inward/citedby.url?scp=0035782964&partnerID=8YFLogxK

M3 - Conference article

AN - SCOPUS:0035782964

SP - 961

EP - 964

JO - SID Conference Record of the International Display Research Conference

JF - SID Conference Record of the International Display Research Conference

SN - 1083-1312

T2 - Asia Display/IDW 2001

Y2 - 16 October 2002 through 19 October 2002

ER -

PDP tubeless packaging using B-stage epoxy

Abstract

ASJC Scopus subject areas

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