Abstract
In this paper, the AC-PDP was packaged with a newly developed tubeless packaging method using a B-stage epoxy. This method was performed at low temperature less than 200°C in He-Ne(27%)-Xe(3%) gas ambient. The PDP was successfully packaged and fully emitted. Also, the driving properties on operating time were investigated.
| Original language | English |
|---|---|
| Pages (from-to) | 961-964 |
| Number of pages | 4 |
| Journal | SID Conference Record of the International Display Research Conference |
| Publication status | Published - 2001 |
| Event | Asia Display/IDW 2001 - Nagoya, Japan Duration: 2002 Oct 16 → 2002 Oct 19 |
ASJC Scopus subject areas
- Electrical and Electronic Engineering
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Cite this
Moon, S. I., Lee, D. J., Oh, M. H., Lee, Y. H., Ju, B. K., Kim, Y. C., Moon, G. J., & Kim, J. D. (2001). PDP tubeless packaging using B-stage epoxy. SID Conference Record of the International Display Research Conference, 961-964.