Peak power constrained closed-form transceiver designs for MIMO AF relaying systems with direct link

Han Bae Kong, Changick Song, Haewook Park, Inkyu Lee

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

In this paper, we propose a new relay transceiver design based on the minimum mean-squared error criterion for non-regenerative multiple-input multiple-output relaying systems with direct link. Since norm power constraint at the relay node does not restrict the output power at each antenna element in designing the relay transceiver, we consider maximum eigenvalue constraint (MVC) which imposes a limit on the peak power of the output. To this end, we first derive the optimal structure of the relay transceiver under the MVC. Then, by introducing an upper bound of the mean-squared error which makes the problem tractable, we provide a closed-form relay transceiver design with the MVC. From simulation results, it is confirmed that the proposed relay transceiver technique demonstrates a significant performance improvement compared to conventional schemes.

Original languageEnglish
Title of host publication2014 IEEE Global Communications Conference, GLOBECOM 2014
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages4318-4323
Number of pages6
ISBN (Electronic)9781479935116
DOIs
Publication statusPublished - 2014 Feb 9
Event2014 IEEE Global Communications Conference, GLOBECOM 2014 - Austin, United States
Duration: 2014 Dec 82014 Dec 12

Other

Other2014 IEEE Global Communications Conference, GLOBECOM 2014
CountryUnited States
CityAustin
Period14/12/814/12/12

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Computer Networks and Communications
  • Communication

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  • Cite this

    Kong, H. B., Song, C., Park, H., & Lee, I. (2014). Peak power constrained closed-form transceiver designs for MIMO AF relaying systems with direct link. In 2014 IEEE Global Communications Conference, GLOBECOM 2014 (pp. 4318-4323). [7037486] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/GLOCOM.2014.7037486