Performance Comparison of InGaN-Based Phosphor Converted and AlGaInP-Based Red Light-Emitting Diode Packages for Vehicle Rear Fog Lamps

Ho Young Kim, Kyoung Mo Kang, Jae Moon Lee, Kwang Ki Choi, Jeong Tak Oh, Hwan Hee Jeong, Tae Yeon Seong

Research output: Contribution to journalArticle

Abstract

We investigated the electrical and optical properties of chip LED and phosphor-converted red LED (pcR-LED) packages for a vehicle rear fog lamp application. The chip LED package had a lower forward voltage, narrower electroluminescence spectrum, and a larger view angle than the pcR-LED package. At 85 °C under 700 mA, the pcR-LED package emitted 26.8% more luminous flux than the chip LED package. After 1000 temperature cycles (-40 to +125 °C), the chip LED packages exhibited a 7.83% maintenance rate variance, whereas the pcR-LED packages showed a 2.78% change. Furthermore, after 1000 h under relative humidity conditions of 85 °C/85% both the samples demonstrated an average maintenance rate >98.66%. At 85 °C under 700 mA, it was demonstrated that the pcR-LED package exhibited a 48.9% lower thermal resistance (junction to package) than the chip LED package. Also for the chip LED package, the temperatures were 58.6 °C at the central region and 61.9 °C at its periphery, whereas the pcR-LED package had temperatures of 70.5 °C at the center and 55.8 °C at the periphery. Unlike the chip LED package, neither current nor temperature significantly affected the CIE coordinates of the pcR-LED packages.

Original languageEnglish
Article number055003
JournalECS Journal of Solid State Science and Technology
Volume9
Issue number5
DOIs
Publication statusPublished - 2020 Jan 6

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials

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