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Phase field simulations of morphological evolution and growth kinetics of solder reaction products
K. K. Hong,
J. Y. Huh
Department of Materials Science and Engineering
Research output
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Contribution to journal
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Article
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peer-review
30
Citations (Scopus)
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Dive into the research topics of 'Phase field simulations of morphological evolution and growth kinetics of solder reaction products'. Together they form a unique fingerprint.
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Engineering & Materials Science
Growth kinetics
100%
Reaction products
90%
Intermetallics
72%
Soldering alloys
67%
Soldering
29%
Grain boundaries
18%
Aging of materials
14%
Interfacial energy
7%
Liquids
4%
Physics & Astronomy
reaction products
76%
solders
76%
intermetallics
61%
kinetics
41%
soldering
31%
simulation
26%
grain boundaries
13%
diffusivity
11%
surface energy
5%
solid state
4%
liquids
3%
Chemical Compounds
Solder
84%
Intermetallic Compound
73%
Simulation
43%
Soldering
34%
Grain Boundary
19%
Interfacial Energy
6%
Liquid
3%