Phase transformation of CuIn xGa 1-x-Se 2 powder by milling and heat treatment

Sin Il Gu, Hyo Soon Shin, Dong Hun Yeo, Sahn Nahm

Research output: Contribution to journalArticle

2 Citations (Scopus)

Abstract

CuIn xGa 1-x-Se 2 ink and paste by milling and subsequent heat treatment to remove organic compounds contained in the thick film are to be crucial to produce dense CuIn xGa 1-x- Se 2 absorber layer, however, few studies has been performed to address such processes. The object of this study is to identify wet milling conditions for CuIn xGa 1-x-Se 2 powder and observe its phase transition and pertinent morphology change according to different heat treatments of CuIn xGa 1-x-Se 2. CuIn xGa 1-x-Se 2 powder was dispersed in planetary mill containing diethylamine as solvent and exhibited no phase transformation. CuIn xGa 1-x-Se 2 disappeared after annealed in air at 200 °C or more. In the case of Se-N 2-H 2 atmosphere, secondary phase in small portion was formed after annealed at 150 °C up to 300 °C whereas CuIn xGa 1-x-Se 2 was maintained above it. Dense CuIn xGa 1-x-Se 2 film was obtained after sintered in Se-H 2-N 2 at 800 °C.

Original languageEnglish
Pages (from-to)4213-4216
Number of pages4
JournalAsian Journal of Chemistry
Volume24
Issue number9
Publication statusPublished - 2012 Jun 5

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Milling (machining)
Powders
Phase transitions
Heat treatment
Ointments
Organic compounds
Thick films
Ink
Air
diethylamine

Keywords

  • CuIn Ga -Se
  • Milling process
  • Phase transformation
  • Solvothermal synthesis
  • Thick film

ASJC Scopus subject areas

  • Chemistry(all)

Cite this

Phase transformation of CuIn xGa 1-x-Se 2 powder by milling and heat treatment. / Gu, Sin Il; Shin, Hyo Soon; Yeo, Dong Hun; Nahm, Sahn.

In: Asian Journal of Chemistry, Vol. 24, No. 9, 05.06.2012, p. 4213-4216.

Research output: Contribution to journalArticle

Gu, Sin Il ; Shin, Hyo Soon ; Yeo, Dong Hun ; Nahm, Sahn. / Phase transformation of CuIn xGa 1-x-Se 2 powder by milling and heat treatment. In: Asian Journal of Chemistry. 2012 ; Vol. 24, No. 9. pp. 4213-4216.
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