Planarization of the surface of electrowetting on dielectric device for droplet speed improvement

Choonghee Lee, Hee Chan Kim, Honggu Chun

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The surface roughness aggravates droplet manipulation speed by increasing contact angle hysteresis (CAH) and pinning force between droplet and an electrowetting on dielectric (EWOD) device. Because spacing between electrodes in the EWOD device cannot be filled up by thin film deposition process for an insulation and hydrophobic layer fabrication, trenches as deep as metal electrode layer are generated on the surface. The trenches increase the surface roughness of EWOD device, especially at the edge. In this work, polishing technique (chemical mechanical polishing, CMP) was appplied to EWOD fabrication to remove the trenches on the surface of the EWOD device. To verify the effect of the surface polishing on droplet speed improvement, we fabricated both unpolished and polished EWOD devices that comprised of 0.5 × 0.5, 1 × 1, and 1.5 × 1.5 mm2 electrodes array to manipulate 1 to 10 μL droplets. Droplet speed on the polished devices was improved by 21 to 100 % compared to that of the unpolished one.

Original languageEnglish
Title of host publication17th International Conference on Miniaturized Systems for Chemistry and Life Sciences, MicroTAS 2013
PublisherChemical and Biological Microsystems Society
Pages1592-1594
Number of pages3
Volume3
ISBN (Print)9781632666246
Publication statusPublished - 2013 Jan 1
Event17th International Conference on Miniaturized Systems for Chemistry and Life Sciences, MicroTAS 2013 - Freiburg, Germany
Duration: 2013 Oct 272013 Oct 31

Other

Other17th International Conference on Miniaturized Systems for Chemistry and Life Sciences, MicroTAS 2013
CountryGermany
CityFreiburg
Period13/10/2713/10/31

Fingerprint

Dielectric devices
Polishing
Electrodes
Surface roughness
Fabrication
Chemical mechanical polishing
Contact angle
Hysteresis
Insulation
Metals
Thin films

ASJC Scopus subject areas

  • Bioengineering

Cite this

Lee, C., Kim, H. C., & Chun, H. (2013). Planarization of the surface of electrowetting on dielectric device for droplet speed improvement. In 17th International Conference on Miniaturized Systems for Chemistry and Life Sciences, MicroTAS 2013 (Vol. 3, pp. 1592-1594). Chemical and Biological Microsystems Society.

Planarization of the surface of electrowetting on dielectric device for droplet speed improvement. / Lee, Choonghee; Kim, Hee Chan; Chun, Honggu.

17th International Conference on Miniaturized Systems for Chemistry and Life Sciences, MicroTAS 2013. Vol. 3 Chemical and Biological Microsystems Society, 2013. p. 1592-1594.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Lee, C, Kim, HC & Chun, H 2013, Planarization of the surface of electrowetting on dielectric device for droplet speed improvement. in 17th International Conference on Miniaturized Systems for Chemistry and Life Sciences, MicroTAS 2013. vol. 3, Chemical and Biological Microsystems Society, pp. 1592-1594, 17th International Conference on Miniaturized Systems for Chemistry and Life Sciences, MicroTAS 2013, Freiburg, Germany, 13/10/27.
Lee C, Kim HC, Chun H. Planarization of the surface of electrowetting on dielectric device for droplet speed improvement. In 17th International Conference on Miniaturized Systems for Chemistry and Life Sciences, MicroTAS 2013. Vol. 3. Chemical and Biological Microsystems Society. 2013. p. 1592-1594
Lee, Choonghee ; Kim, Hee Chan ; Chun, Honggu. / Planarization of the surface of electrowetting on dielectric device for droplet speed improvement. 17th International Conference on Miniaturized Systems for Chemistry and Life Sciences, MicroTAS 2013. Vol. 3 Chemical and Biological Microsystems Society, 2013. pp. 1592-1594
@inproceedings{028140f6c4184855abc498ce64f62a0f,
title = "Planarization of the surface of electrowetting on dielectric device for droplet speed improvement",
abstract = "The surface roughness aggravates droplet manipulation speed by increasing contact angle hysteresis (CAH) and pinning force between droplet and an electrowetting on dielectric (EWOD) device. Because spacing between electrodes in the EWOD device cannot be filled up by thin film deposition process for an insulation and hydrophobic layer fabrication, trenches as deep as metal electrode layer are generated on the surface. The trenches increase the surface roughness of EWOD device, especially at the edge. In this work, polishing technique (chemical mechanical polishing, CMP) was appplied to EWOD fabrication to remove the trenches on the surface of the EWOD device. To verify the effect of the surface polishing on droplet speed improvement, we fabricated both unpolished and polished EWOD devices that comprised of 0.5 × 0.5, 1 × 1, and 1.5 × 1.5 mm2 electrodes array to manipulate 1 to 10 μL droplets. Droplet speed on the polished devices was improved by 21 to 100 {\%} compared to that of the unpolished one.",
keywords = "CMP, Droplet speed, EWOD, Trench",
author = "Choonghee Lee and Kim, {Hee Chan} and Honggu Chun",
year = "2013",
month = "1",
day = "1",
language = "English",
isbn = "9781632666246",
volume = "3",
pages = "1592--1594",
booktitle = "17th International Conference on Miniaturized Systems for Chemistry and Life Sciences, MicroTAS 2013",
publisher = "Chemical and Biological Microsystems Society",

}

TY - GEN

T1 - Planarization of the surface of electrowetting on dielectric device for droplet speed improvement

AU - Lee, Choonghee

AU - Kim, Hee Chan

AU - Chun, Honggu

PY - 2013/1/1

Y1 - 2013/1/1

N2 - The surface roughness aggravates droplet manipulation speed by increasing contact angle hysteresis (CAH) and pinning force between droplet and an electrowetting on dielectric (EWOD) device. Because spacing between electrodes in the EWOD device cannot be filled up by thin film deposition process for an insulation and hydrophobic layer fabrication, trenches as deep as metal electrode layer are generated on the surface. The trenches increase the surface roughness of EWOD device, especially at the edge. In this work, polishing technique (chemical mechanical polishing, CMP) was appplied to EWOD fabrication to remove the trenches on the surface of the EWOD device. To verify the effect of the surface polishing on droplet speed improvement, we fabricated both unpolished and polished EWOD devices that comprised of 0.5 × 0.5, 1 × 1, and 1.5 × 1.5 mm2 electrodes array to manipulate 1 to 10 μL droplets. Droplet speed on the polished devices was improved by 21 to 100 % compared to that of the unpolished one.

AB - The surface roughness aggravates droplet manipulation speed by increasing contact angle hysteresis (CAH) and pinning force between droplet and an electrowetting on dielectric (EWOD) device. Because spacing between electrodes in the EWOD device cannot be filled up by thin film deposition process for an insulation and hydrophobic layer fabrication, trenches as deep as metal electrode layer are generated on the surface. The trenches increase the surface roughness of EWOD device, especially at the edge. In this work, polishing technique (chemical mechanical polishing, CMP) was appplied to EWOD fabrication to remove the trenches on the surface of the EWOD device. To verify the effect of the surface polishing on droplet speed improvement, we fabricated both unpolished and polished EWOD devices that comprised of 0.5 × 0.5, 1 × 1, and 1.5 × 1.5 mm2 electrodes array to manipulate 1 to 10 μL droplets. Droplet speed on the polished devices was improved by 21 to 100 % compared to that of the unpolished one.

KW - CMP

KW - Droplet speed

KW - EWOD

KW - Trench

UR - http://www.scopus.com/inward/record.url?scp=84907376019&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84907376019&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:84907376019

SN - 9781632666246

VL - 3

SP - 1592

EP - 1594

BT - 17th International Conference on Miniaturized Systems for Chemistry and Life Sciences, MicroTAS 2013

PB - Chemical and Biological Microsystems Society

ER -