Abstract
The surface roughness aggravates droplet manipulation speed by increasing contact angle hysteresis (CAH) and pinning force between droplet and an electrowetting on dielectric (EWOD) device. Because spacing between electrodes in the EWOD device cannot be filled up by thin film deposition process for an insulation and hydrophobic layer fabrication, trenches as deep as metal electrode layer are generated on the surface. The trenches increase the surface roughness of EWOD device, especially at the edge. In this work, polishing technique (chemical mechanical polishing, CMP) was appplied to EWOD fabrication to remove the trenches on the surface of the EWOD device. To verify the effect of the surface polishing on droplet speed improvement, we fabricated both unpolished and polished EWOD devices that comprised of 0.5 × 0.5, 1 × 1, and 1.5 × 1.5 mm2 electrodes array to manipulate 1 to 10 μL droplets. Droplet speed on the polished devices was improved by 21 to 100 % compared to that of the unpolished one.
| Original language | English |
|---|---|
| Title of host publication | 17th International Conference on Miniaturized Systems for Chemistry and Life Sciences, MicroTAS 2013 |
| Publisher | Chemical and Biological Microsystems Society |
| Pages | 1592-1594 |
| Number of pages | 3 |
| Volume | 3 |
| ISBN (Print) | 9781632666246 |
| Publication status | Published - 2013 Jan 1 |
| Event | 17th International Conference on Miniaturized Systems for Chemistry and Life Sciences, MicroTAS 2013 - Freiburg, Germany Duration: 2013 Oct 27 → 2013 Oct 31 |
Other
| Other | 17th International Conference on Miniaturized Systems for Chemistry and Life Sciences, MicroTAS 2013 |
|---|---|
| Country | Germany |
| City | Freiburg |
| Period | 13/10/27 → 13/10/31 |
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ASJC Scopus subject areas
- Bioengineering
Cite this
Planarization of the surface of electrowetting on dielectric device for droplet speed improvement. / Lee, Choonghee; Kim, Hee Chan; Chun, Honggu.
17th International Conference on Miniaturized Systems for Chemistry and Life Sciences, MicroTAS 2013. Vol. 3 Chemical and Biological Microsystems Society, 2013. p. 1592-1594.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - Planarization of the surface of electrowetting on dielectric device for droplet speed improvement
AU - Lee, Choonghee
AU - Kim, Hee Chan
AU - Chun, Honggu
PY - 2013/1/1
Y1 - 2013/1/1
N2 - The surface roughness aggravates droplet manipulation speed by increasing contact angle hysteresis (CAH) and pinning force between droplet and an electrowetting on dielectric (EWOD) device. Because spacing between electrodes in the EWOD device cannot be filled up by thin film deposition process for an insulation and hydrophobic layer fabrication, trenches as deep as metal electrode layer are generated on the surface. The trenches increase the surface roughness of EWOD device, especially at the edge. In this work, polishing technique (chemical mechanical polishing, CMP) was appplied to EWOD fabrication to remove the trenches on the surface of the EWOD device. To verify the effect of the surface polishing on droplet speed improvement, we fabricated both unpolished and polished EWOD devices that comprised of 0.5 × 0.5, 1 × 1, and 1.5 × 1.5 mm2 electrodes array to manipulate 1 to 10 μL droplets. Droplet speed on the polished devices was improved by 21 to 100 % compared to that of the unpolished one.
AB - The surface roughness aggravates droplet manipulation speed by increasing contact angle hysteresis (CAH) and pinning force between droplet and an electrowetting on dielectric (EWOD) device. Because spacing between electrodes in the EWOD device cannot be filled up by thin film deposition process for an insulation and hydrophobic layer fabrication, trenches as deep as metal electrode layer are generated on the surface. The trenches increase the surface roughness of EWOD device, especially at the edge. In this work, polishing technique (chemical mechanical polishing, CMP) was appplied to EWOD fabrication to remove the trenches on the surface of the EWOD device. To verify the effect of the surface polishing on droplet speed improvement, we fabricated both unpolished and polished EWOD devices that comprised of 0.5 × 0.5, 1 × 1, and 1.5 × 1.5 mm2 electrodes array to manipulate 1 to 10 μL droplets. Droplet speed on the polished devices was improved by 21 to 100 % compared to that of the unpolished one.
KW - CMP
KW - Droplet speed
KW - EWOD
KW - Trench
UR - http://www.scopus.com/inward/record.url?scp=84907376019&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84907376019&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:84907376019
SN - 9781632666246
VL - 3
SP - 1592
EP - 1594
BT - 17th International Conference on Miniaturized Systems for Chemistry and Life Sciences, MicroTAS 2013
PB - Chemical and Biological Microsystems Society
ER -