Practical verification of power delivery networks for smart TV applications

Baekseok Ko, Joowon Kim, Jaemin Ryoo, Chulsoon Hwang, Seung Baek Park, Soo-Won Kim

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

This paper introduces a practical methodology to improve power integrity performance of the chip-package-PCB systems for smart TVs. For power integrity analysis, a chip, package and PCB are modeled as lumped element circuits for simplicity. Case studies are presented to optimize MLCC placement using chip-package-PCB co-simulation under fixed SoC design. In case studies, CPU power net of an application processor is chosen, and voltage droop is measured as a design weight on each physical domains. The introduced methodology is evaluated through experimental verifications.

Original languageEnglish
Title of host publication2015 IEEE International Conference on Consumer Electronics, ICCE 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages594-595
Number of pages2
ISBN (Print)9781479975426
DOIs
Publication statusPublished - 2015 Mar 23
Event2015 IEEE International Conference on Consumer Electronics, ICCE 2015 - Las Vegas, United States
Duration: 2015 Jan 92015 Jan 12

Other

Other2015 IEEE International Conference on Consumer Electronics, ICCE 2015
CountryUnited States
CityLas Vegas
Period15/1/915/1/12

Keywords

  • AP
  • decoupling capacitor
  • ODC
  • ODR
  • on co-simulation
  • power integrity
  • power modeling
  • power noise

ASJC Scopus subject areas

  • Computer Networks and Communications
  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering

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  • Cite this

    Ko, B., Kim, J., Ryoo, J., Hwang, C., Park, S. B., & Kim, S-W. (2015). Practical verification of power delivery networks for smart TV applications. In 2015 IEEE International Conference on Consumer Electronics, ICCE 2015 (pp. 594-595). [7066541] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICCE.2015.7066541