Prediction of thermal and elastic properties of honeycomb sandwich plate for analysis of thermal deformation

Seok Min Hong, Jang Il Lee, Jae Ki Byun, Young Don Choi

Research output: Contribution to journalArticle

Abstract

Thermal problems that are directly related to the lifetime of an electronic device are becoming increasingly important owing to the miniaturization of electronic devices. To solve thermal problems, it is essential to study thermal stability through thermal diffusion and insulation. A honeycomb sandwich plate has anisotropic thermal conductivity. To analyze the thermal deformation and temperature distribution of a system that employs a honeycomb sandwich plate, the thermal and elastic properties need to be determined. In this study, the thermal and elastic properties of a honeycomb sandwich plate, such as thermal conductivity, coefficient of thermal expansion, elastic modulus, Poisson's ratio, and shear modulus, are predicted. The properties of a honeycomb sandwich plate vary according to the hexagon size, thickness, and material properties.

Original languageEnglish
Pages (from-to)347-355
Number of pages9
JournalTransactions of the Korean Society of Mechanical Engineers, B
Volume38
Issue number4
DOIs
Publication statusPublished - 2014 Apr

Keywords

  • Anisotropy
  • Coefficient of thermal expansion
  • Composite
  • Elastic properties
  • Heat transfer
  • Honeycomb
  • Sandwiching
  • Thermal conductivity
  • Thermal deformation
  • Thermal properties

ASJC Scopus subject areas

  • Mechanical Engineering

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