Process stability enhancement by encapsulation extrusion method

Joo Sung Lee, Hyun Wook Jung, Jae Chun Hyun

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A film casting simulation has been used to demonstrate why the encapsulation extrusion process is so effective industrially in enhancing the stability of the extrusion. In the present study, it is intended to explain theoretically why and how the coextrusion of LDPE in encapsulation dies improves the HDPE process. The undesirable neck-in and draw resonance phenomena frequently occurring in the extrusion of HDPE are shown due to its low-melt-strength property, and consequently can be alleviated using high-melt-strength materials in the encapsulating dies.

Original languageEnglish
Title of host publicationAnnual Technical Conference - ANTEC, Conference Proceedings
Pages54-58
Number of pages5
Volume1
Publication statusPublished - 2003 Oct 14
Event61st Annual Technical Conference ANTEC 2003 - Nashville, TN, United States
Duration: 2003 May 42003 May 8

Other

Other61st Annual Technical Conference ANTEC 2003
CountryUnited States
CityNashville, TN
Period03/5/403/5/8

Fingerprint

Encapsulation
Extrusion
High density polyethylenes
Coextrusion
Low density polyethylenes
Casting

Keywords

  • Draw resonance
  • Encapsulation
  • Film casting
  • Stability

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Lee, J. S., Jung, H. W., & Hyun, J. C. (2003). Process stability enhancement by encapsulation extrusion method. In Annual Technical Conference - ANTEC, Conference Proceedings (Vol. 1, pp. 54-58)

Process stability enhancement by encapsulation extrusion method. / Lee, Joo Sung; Jung, Hyun Wook; Hyun, Jae Chun.

Annual Technical Conference - ANTEC, Conference Proceedings. Vol. 1 2003. p. 54-58.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Lee, JS, Jung, HW & Hyun, JC 2003, Process stability enhancement by encapsulation extrusion method. in Annual Technical Conference - ANTEC, Conference Proceedings. vol. 1, pp. 54-58, 61st Annual Technical Conference ANTEC 2003, Nashville, TN, United States, 03/5/4.
Lee JS, Jung HW, Hyun JC. Process stability enhancement by encapsulation extrusion method. In Annual Technical Conference - ANTEC, Conference Proceedings. Vol. 1. 2003. p. 54-58
Lee, Joo Sung ; Jung, Hyun Wook ; Hyun, Jae Chun. / Process stability enhancement by encapsulation extrusion method. Annual Technical Conference - ANTEC, Conference Proceedings. Vol. 1 2003. pp. 54-58
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