Abstract
Bi-based glass powders with low glass transition temperature of 373°C for silver paste were directly prepared by spray pyrolysis at 1200°C. The mean size and geometric standard deviation of the glass powders with spherical shape were 0. 75 μm and 1. 3. The glass film formed from the prepared glass powders had clean surface and cross-section at a firing temperature of 450°C. Adhesion properties between the silver electrode and glass substrate improved with increase of the addition amount of glass powders into silver paste and the firing temperatures. The addition of glass powders decreased the sheet resistances of the silver conducting films irrespective of firing temperatures. The sheet resistances of silver conducting films were changed from 7. 7 to 5. 5 μΩcm when the glass content added to the silver paste were changed from 0 to 5 wt. % at a firing temperature of 550°C.
| Original language | English |
|---|---|
| Pages (from-to) | 643-648 |
| Number of pages | 6 |
| Journal | Electronic Materials Letters |
| Volume | 8 |
| Issue number | 6 |
| DOIs | |
| Publication status | Published - 2012 Dec 1 |
| Externally published | Yes |
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Keywords
- electrode material
- glass powder
- silver powder
- spray pyrolysis
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
Cite this
Properties of Bi-based glass powders with low glass transition temperature, spherical shape and fine size as the additive of silver conducting paste. / Jung, D. S.; Kim, J. H.; Hong, Y. J.; Kang, Yun Chan.
In: Electronic Materials Letters, Vol. 8, No. 6, 01.12.2012, p. 643-648.Research output: Contribution to journal › Article
}
TY - JOUR
T1 - Properties of Bi-based glass powders with low glass transition temperature, spherical shape and fine size as the additive of silver conducting paste
AU - Jung, D. S.
AU - Kim, J. H.
AU - Hong, Y. J.
AU - Kang, Yun Chan
PY - 2012/12/1
Y1 - 2012/12/1
N2 - Bi-based glass powders with low glass transition temperature of 373°C for silver paste were directly prepared by spray pyrolysis at 1200°C. The mean size and geometric standard deviation of the glass powders with spherical shape were 0. 75 μm and 1. 3. The glass film formed from the prepared glass powders had clean surface and cross-section at a firing temperature of 450°C. Adhesion properties between the silver electrode and glass substrate improved with increase of the addition amount of glass powders into silver paste and the firing temperatures. The addition of glass powders decreased the sheet resistances of the silver conducting films irrespective of firing temperatures. The sheet resistances of silver conducting films were changed from 7. 7 to 5. 5 μΩcm when the glass content added to the silver paste were changed from 0 to 5 wt. % at a firing temperature of 550°C.
AB - Bi-based glass powders with low glass transition temperature of 373°C for silver paste were directly prepared by spray pyrolysis at 1200°C. The mean size and geometric standard deviation of the glass powders with spherical shape were 0. 75 μm and 1. 3. The glass film formed from the prepared glass powders had clean surface and cross-section at a firing temperature of 450°C. Adhesion properties between the silver electrode and glass substrate improved with increase of the addition amount of glass powders into silver paste and the firing temperatures. The addition of glass powders decreased the sheet resistances of the silver conducting films irrespective of firing temperatures. The sheet resistances of silver conducting films were changed from 7. 7 to 5. 5 μΩcm when the glass content added to the silver paste were changed from 0 to 5 wt. % at a firing temperature of 550°C.
KW - electrode material
KW - glass powder
KW - silver powder
KW - spray pyrolysis
UR - http://www.scopus.com/inward/record.url?scp=84871654939&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84871654939&partnerID=8YFLogxK
U2 - 10.1007/s13391-012-2050-x
DO - 10.1007/s13391-012-2050-x
M3 - Article
AN - SCOPUS:84871654939
VL - 8
SP - 643
EP - 648
JO - Electronic Materials Letters
JF - Electronic Materials Letters
SN - 1738-8090
IS - 6
ER -