Prototype demonstration of low cost uncooled infrared focal plane arrays by using simple readout circuit

Kuntae Kim, Yong Hee Han, Nguyen Chi Anh, Hyun Joon Shin, Sung Moon, Jung ho Park

Research output: Contribution to journalArticle

7 Citations (Scopus)

Abstract

A new simple readout circuit is proposed for uncooled infrared focal plane arrays. Using this circuit, we have demonstrated the prototype of an infrared imaging system with 64 pixel elements. To get the infrared image, we employed a direct wire bonding between the bolometer array and the external multiplex circuits, instead of a complex and expensive CMOS integrated circuit. We verified that this readout method could form an easy electrical connection between bolometer arrays and readout electronics, so we fabricated the infrared imaging system at very low cost and in a reasonable time. We fabricated the VO x- 8 × 8 bolometer arrays and readout circuit, respectively, and these are interconnected by wire bonding. Using this readout method, we constructed the infrared imaging system and acquired a very clear cross-shaped infrared image.

Original languageEnglish
Pages (from-to)1149-1153
Number of pages5
JournalJournal of the Korean Physical Society
Volume45
Issue number5 I
Publication statusPublished - 2004 Nov 1

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focal plane devices
readout
prototypes
bolometers
wire
integrated circuits
CMOS
pixels
electronics

ASJC Scopus subject areas

  • Physics and Astronomy(all)

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Prototype demonstration of low cost uncooled infrared focal plane arrays by using simple readout circuit. / Kim, Kuntae; Han, Yong Hee; Anh, Nguyen Chi; Shin, Hyun Joon; Moon, Sung; Park, Jung ho.

In: Journal of the Korean Physical Society, Vol. 45, No. 5 I, 01.11.2004, p. 1149-1153.

Research output: Contribution to journalArticle

Kim, Kuntae ; Han, Yong Hee ; Anh, Nguyen Chi ; Shin, Hyun Joon ; Moon, Sung ; Park, Jung ho. / Prototype demonstration of low cost uncooled infrared focal plane arrays by using simple readout circuit. In: Journal of the Korean Physical Society. 2004 ; Vol. 45, No. 5 I. pp. 1149-1153.
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