Providing extra memory for virtual machines by sharing compressed swap pages

Jonghee Yun, Chiyoung Lee, Chuck Yoo

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

Virtualization systems are currently being applied to embedded devices such as TVs and cell phones. However, these embedded devices have insufficient memory, which can decrease the performance of an application. To provide more memory and improve the performance of applications on a virtual machine, we propose an effective swapping method. When a swap-out occurs on a virtual machine, we compress the swapped page and send it to another virtual machine with sufficient memory. If a compressed swapped page already exists, it will be shared with other virtual machines. By compressing and sharing the swapped pages, our method can reduce their number by 79%.

Original languageEnglish
Title of host publication2014 IEEE International Conference on Consumer Electronics, ICCE 2014
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages430-431
Number of pages2
ISBN (Print)9781479912919
DOIs
Publication statusPublished - 2014
Event2014 IEEE International Conference on Consumer Electronics, ICCE 2014 - Las Vegas, NV, United States
Duration: 2014 Jan 102014 Jan 13

Publication series

NameDigest of Technical Papers - IEEE International Conference on Consumer Electronics
ISSN (Print)0747-668X

Other

Other2014 IEEE International Conference on Consumer Electronics, ICCE 2014
CountryUnited States
CityLas Vegas, NV
Period14/1/1014/1/13

ASJC Scopus subject areas

  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering

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  • Cite this

    Yun, J., Lee, C., & Yoo, C. (2014). Providing extra memory for virtual machines by sharing compressed swap pages. In 2014 IEEE International Conference on Consumer Electronics, ICCE 2014 (pp. 430-431). [6776072] (Digest of Technical Papers - IEEE International Conference on Consumer Electronics). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICCE.2014.6776072