Quality factor measurement of micro gyroscope structure according to vacuum level and desired Q-factor range package method

Jong Seok Kim, Sang Woo Lee, Kyu Dong Jung, Woon Bae Kim, Sung Hoon Choa, Byeong Kwon Ju

Research output: Contribution to journalArticle

9 Citations (Scopus)

Abstract

A micro-machined gyro chip of gyroscope is normally packaged in specific vacuum level to get the specific quality factor(Q-factor). If the Q-factor is too high, frequency tuning and the approximate matching between driving and sensing comb structure become difficult, and if the Q-factor is too low, its sensitivity decreases. The optimum Q-factor of our gyro chip design is 4000 range. To get this range, we measured the drive mode Q-factor as vacuum level of our gyro chip and we found that the vacuum level of the desired Q-factor 4000 is in the range of 740 mTorr. Based on this data, we fabricate the wafer level package gyro chip of the desired Q-factor by controlled the basic pressure of package bonding chamber just prior to the bonding process. After wafer level package process, we measured Q-factor of whole samples. Among 804 samples, 502 packaged gyro chips are worked and the Q-factor of 67% samples is between 3500 and 4500 range.

Original languageEnglish
Pages (from-to)948-952
Number of pages5
JournalMicroelectronics Reliability
Volume48
Issue number6
DOIs
Publication statusPublished - 2008 Jun

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Safety, Risk, Reliability and Quality
  • Condensed Matter Physics
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering

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