Quantitative method to measure thermal conductivity of one-dimensional nanostructures based on scanning thermal wave microscopy

Kyung Bae Park, Jae Hun Chung, Gwang Seok Hwang, Eui Han Jung, Oh Myoung Kwon

Research output: Contribution to journalArticle

Abstract

We present a method to quantitatively measure the thermal conductivity of one-dimensional nanostructures by utilizing scanning thermal wave microscopy (STWM) at a nanoscale spatial resolution. In this paper, we explain the principle for measuring the thermal diffusivity of one-dimensional nanostructures using STWM and the theoretical analysis procedure for quantifying the thermal diffusivity. The SWTM measurement method obtains the thermal conductivity by measuring the thermal diffusivity, which has only a phase lag relative to the distance corresponding to the transferred thermal wave. It is not affected by the thermal contact resistances between the heat source and nanostructure and between the nanostructure and probe. Thus, the heat flux applied to the nanostructure is accurately obtained. The proposed method provides a very simple and quantitative measurement relative to conventional measurement techniques.

Original languageEnglish
Pages (from-to)957-962
Number of pages6
JournalTransactions of the Korean Society of Mechanical Engineers, B
Volume38
Issue number12
DOIs
Publication statusPublished - 2014

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Nanostructures
Thermal conductivity
Microscopic examination
Thermal diffusivity
Scanning
Contact resistance
Heat flux
Hot Temperature

Keywords

  • Nanostructure
  • Scanning Thermal Wave Microscopy
  • Thermal Conductivity
  • Thermal Contact Resistance

ASJC Scopus subject areas

  • Mechanical Engineering

Cite this

Quantitative method to measure thermal conductivity of one-dimensional nanostructures based on scanning thermal wave microscopy. / Park, Kyung Bae; Chung, Jae Hun; Hwang, Gwang Seok; Jung, Eui Han; Kwon, Oh Myoung.

In: Transactions of the Korean Society of Mechanical Engineers, B, Vol. 38, No. 12, 2014, p. 957-962.

Research output: Contribution to journalArticle

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