Quench development in Bi-2212 bulk coils during quenches

Hye Rim Kim, Jungwook Sim, Inji Choi, Seong Woo Yim, Haigun Lee, Ok Bae Hyun

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

We investigated the quench development in resistive superconducting fault current limiters (SFCLs) based on Bi2Sr2CaCu 2O8 (Bi-2212) bulk coils. In order to protect them from hot spot formation, the bulk coils were either attached with a metal shunt layer or connected with a shunt coil in parallel. The bulk coils also had a plastic support for enhanced mechanical strength and insulation. The SFCLs were subjected to simulated AC fault currents for quench measurements. They were immersed in liquid nitrogen during the experiment for effective cooling. The resistance of the Bi-2212 bulk coil stayed low for a few milliseconds, until it increased rapidly. The increase was more rapid in the SFCL with a shunt coil than with a shunt layer. Once the quench was completed, the resistance increased at slower rates. The average temperature of the bulk coil reached about 230 K at 3 cycles after quench start at application voltage of 2.4 Vrms/cm with a shunt coil, and at 0.4 Vrms/cm with a shunt layer. The resistance development in Bi-2212 bulk coils could be quantitatively explained with the concept of transfer of heat generated during quenches to the liquid nitrogen as well as within the Bi-2212 bulk. The fault period was divided into three regions: flux-flow region, region prior-to quench completion, and region after quench completion. Resistance was calculated separately for each region and compared with data. The results agreed well with data.

Original languageEnglish
Pages (from-to)1875-1878
Number of pages4
JournalIEEE Transactions on Applied Superconductivity
Volume17
Issue number2
DOIs
Publication statusPublished - 2007 Jun

Keywords

  • Bi-2212 bulk
  • Heat transfer
  • Quench
  • Superconducting fault current limiter

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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