Rational design of epoxy/ ZIF-8 nanocomposites for enhanced suppression of copper ion migration

Seok Hwan Lee, Heun Young Seo, Yong Sik Yeom, Jong Eun Kim, Heseong An, Jong Suk Lee, Hae Kwon Jeong, Kyung Youl Baek, Kie Yong Cho, Ho Gyu Yoon

Research output: Contribution to journalArticle

5 Citations (Scopus)

Abstract

Various failure modes derived from the electrochemical migration (ECM) through the dielectric polymer layers have been considered critical issues in the electronic devices. Herein, we for the first time suggested the rationally designed epoxy/zeolitic imidazolate framework-8 (ZIF-8) nanocomposite materials for efficient suppression of copper ion migration based on the plausible reaction mechanisms of metal metathesis addressed by sequential cleaving and ligating between metal ions (Zn2+ and Cu2+) and 2-methylimidazole (2-mim) ligands. The fabrication process for epoxy/ZIF-8 (EZ) nanocomposites was first examined to optimize the crosslinking system. The capability of the metal ion capture in the EZ nanocomposites was examined using the aqueous solution containing Cu2+ ions. In addition, the ECM suppression properties were evaluated using the thermal humidity bias (THB) model testing. The representative model investigations with the EZ nanocomposites exhibited substantially enhanced copper ion adsorption and suppression of copper migration in comparison to those of epoxy. Hence, the EZ nanocomposites can be one promising material to alleviate the undesired ECM behavior in electronic device applications.

Original languageEnglish
Pages (from-to)159-168
Number of pages10
JournalPolymer (United Kingdom)
Volume150
DOIs
Publication statusPublished - 2018 Aug 15

Fingerprint

Copper
Nanocomposites
Ions
Metal ions
Crosslinking
Failure modes
Atmospheric humidity
Polymers
Metals
Ligands
Adsorption
Fabrication
Testing

Keywords

  • Copper migration suppression
  • Epoxy nanocomposites
  • ZIF-8

ASJC Scopus subject areas

  • Organic Chemistry
  • Polymers and Plastics

Cite this

Rational design of epoxy/ ZIF-8 nanocomposites for enhanced suppression of copper ion migration. / Lee, Seok Hwan; Seo, Heun Young; Yeom, Yong Sik; Kim, Jong Eun; An, Heseong; Lee, Jong Suk; Jeong, Hae Kwon; Baek, Kyung Youl; Cho, Kie Yong; Yoon, Ho Gyu.

In: Polymer (United Kingdom), Vol. 150, 15.08.2018, p. 159-168.

Research output: Contribution to journalArticle

Lee, SH, Seo, HY, Yeom, YS, Kim, JE, An, H, Lee, JS, Jeong, HK, Baek, KY, Cho, KY & Yoon, HG 2018, 'Rational design of epoxy/ ZIF-8 nanocomposites for enhanced suppression of copper ion migration', Polymer (United Kingdom), vol. 150, pp. 159-168. https://doi.org/10.1016/j.polymer.2018.05.062
Lee, Seok Hwan ; Seo, Heun Young ; Yeom, Yong Sik ; Kim, Jong Eun ; An, Heseong ; Lee, Jong Suk ; Jeong, Hae Kwon ; Baek, Kyung Youl ; Cho, Kie Yong ; Yoon, Ho Gyu. / Rational design of epoxy/ ZIF-8 nanocomposites for enhanced suppression of copper ion migration. In: Polymer (United Kingdom). 2018 ; Vol. 150. pp. 159-168.
@article{1e51ea31873941a7b74b2bd89f2e0cbf,
title = "Rational design of epoxy/ ZIF-8 nanocomposites for enhanced suppression of copper ion migration",
abstract = "Various failure modes derived from the electrochemical migration (ECM) through the dielectric polymer layers have been considered critical issues in the electronic devices. Herein, we for the first time suggested the rationally designed epoxy/zeolitic imidazolate framework-8 (ZIF-8) nanocomposite materials for efficient suppression of copper ion migration based on the plausible reaction mechanisms of metal metathesis addressed by sequential cleaving and ligating between metal ions (Zn2+ and Cu2+) and 2-methylimidazole (2-mim) ligands. The fabrication process for epoxy/ZIF-8 (EZ) nanocomposites was first examined to optimize the crosslinking system. The capability of the metal ion capture in the EZ nanocomposites was examined using the aqueous solution containing Cu2+ ions. In addition, the ECM suppression properties were evaluated using the thermal humidity bias (THB) model testing. The representative model investigations with the EZ nanocomposites exhibited substantially enhanced copper ion adsorption and suppression of copper migration in comparison to those of epoxy. Hence, the EZ nanocomposites can be one promising material to alleviate the undesired ECM behavior in electronic device applications.",
keywords = "Copper migration suppression, Epoxy nanocomposites, ZIF-8",
author = "Lee, {Seok Hwan} and Seo, {Heun Young} and Yeom, {Yong Sik} and Kim, {Jong Eun} and Heseong An and Lee, {Jong Suk} and Jeong, {Hae Kwon} and Baek, {Kyung Youl} and Cho, {Kie Yong} and Yoon, {Ho Gyu}",
year = "2018",
month = "8",
day = "15",
doi = "10.1016/j.polymer.2018.05.062",
language = "English",
volume = "150",
pages = "159--168",
journal = "Polymer (United Kingdom)",
issn = "0032-3861",
publisher = "Elsevier BV",

}

TY - JOUR

T1 - Rational design of epoxy/ ZIF-8 nanocomposites for enhanced suppression of copper ion migration

AU - Lee, Seok Hwan

AU - Seo, Heun Young

AU - Yeom, Yong Sik

AU - Kim, Jong Eun

AU - An, Heseong

AU - Lee, Jong Suk

AU - Jeong, Hae Kwon

AU - Baek, Kyung Youl

AU - Cho, Kie Yong

AU - Yoon, Ho Gyu

PY - 2018/8/15

Y1 - 2018/8/15

N2 - Various failure modes derived from the electrochemical migration (ECM) through the dielectric polymer layers have been considered critical issues in the electronic devices. Herein, we for the first time suggested the rationally designed epoxy/zeolitic imidazolate framework-8 (ZIF-8) nanocomposite materials for efficient suppression of copper ion migration based on the plausible reaction mechanisms of metal metathesis addressed by sequential cleaving and ligating between metal ions (Zn2+ and Cu2+) and 2-methylimidazole (2-mim) ligands. The fabrication process for epoxy/ZIF-8 (EZ) nanocomposites was first examined to optimize the crosslinking system. The capability of the metal ion capture in the EZ nanocomposites was examined using the aqueous solution containing Cu2+ ions. In addition, the ECM suppression properties were evaluated using the thermal humidity bias (THB) model testing. The representative model investigations with the EZ nanocomposites exhibited substantially enhanced copper ion adsorption and suppression of copper migration in comparison to those of epoxy. Hence, the EZ nanocomposites can be one promising material to alleviate the undesired ECM behavior in electronic device applications.

AB - Various failure modes derived from the electrochemical migration (ECM) through the dielectric polymer layers have been considered critical issues in the electronic devices. Herein, we for the first time suggested the rationally designed epoxy/zeolitic imidazolate framework-8 (ZIF-8) nanocomposite materials for efficient suppression of copper ion migration based on the plausible reaction mechanisms of metal metathesis addressed by sequential cleaving and ligating between metal ions (Zn2+ and Cu2+) and 2-methylimidazole (2-mim) ligands. The fabrication process for epoxy/ZIF-8 (EZ) nanocomposites was first examined to optimize the crosslinking system. The capability of the metal ion capture in the EZ nanocomposites was examined using the aqueous solution containing Cu2+ ions. In addition, the ECM suppression properties were evaluated using the thermal humidity bias (THB) model testing. The representative model investigations with the EZ nanocomposites exhibited substantially enhanced copper ion adsorption and suppression of copper migration in comparison to those of epoxy. Hence, the EZ nanocomposites can be one promising material to alleviate the undesired ECM behavior in electronic device applications.

KW - Copper migration suppression

KW - Epoxy nanocomposites

KW - ZIF-8

UR - http://www.scopus.com/inward/record.url?scp=85049945074&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85049945074&partnerID=8YFLogxK

U2 - 10.1016/j.polymer.2018.05.062

DO - 10.1016/j.polymer.2018.05.062

M3 - Article

AN - SCOPUS:85049945074

VL - 150

SP - 159

EP - 168

JO - Polymer (United Kingdom)

JF - Polymer (United Kingdom)

SN - 0032-3861

ER -