Recent thermal management techniques for microprocessors

Joonho Kong, Sung Woo Jung, Kevin Skadron

Research output: Contribution to journalArticle

115 Citations (Scopus)

Abstract

Microprocessor design has recently encountered many constraints such as power, energy, reliability, and temperature. Among these challenging issues, temperature-related issues have become especially important within the past several years. We summarize recent thermal management techniques for microprocessors, focusing on those that affect or rely on themicroarchitecture. We categorize thermal management techniques into sixmain categories: temperaturemonitoring, microarchitectural techniques, floorplanning, OS/compiler techniques, liquid cooling techniques, and thermal reliability/security. Temperature monitoring, a requirement for Dynamic Thermal Management (DTM), includes temperature estimation and sensor placement techniques for accurate temperature measurement or estimation. Microarchitectural techniques include both static and dynamic thermal management techniques that control hardware structures. Floorplanning covers a range of thermal-aware floorplanning techniques for 2D and 3D microprocessors. OS/compiler techniques include thermal-aware task scheduling and instruction scheduling techniques. Liquid cooling techniques are higher-capacity alternatives to conventional air cooling techniques. Thermal reliability/security issues cover temperature-dependent reliability modeling, Dynamic Reliability Management (DRM), and malicious codes that specifically cause overheating. Temperature-related issues will only become more challenging as process technology continues to evolve and transistor densities scale up faster than power per transistor scales down. The overall objective of this survey is to give microprocessor designers a broad perspective on various aspects of designing thermal-aware microprocessors and to guide future thermal management studies.

Original languageEnglish
Article number13
JournalACM Computing Surveys
Volume44
Issue number3
DOIs
Publication statusPublished - 2012 Jun 1

Fingerprint

Thermal Management
Microprocessor
Temperature control
Microprocessor chips
Floorplanning
Cooling
Temperature
Transistors
Scheduling
Liquids
Temperature measurement
Compiler
Hot Temperature
Instruction Scheduling
Hardware
Cover
Liquid
Sensor Placement
Reliability Modeling
Monitoring

Keywords

  • Microprocessor
  • Performance and reliability
  • Thermal management

ASJC Scopus subject areas

  • Computer Science(all)
  • Theoretical Computer Science

Cite this

Recent thermal management techniques for microprocessors. / Kong, Joonho; Jung, Sung Woo; Skadron, Kevin.

In: ACM Computing Surveys, Vol. 44, No. 3, 13, 01.06.2012.

Research output: Contribution to journalArticle

Kong, Joonho ; Jung, Sung Woo ; Skadron, Kevin. / Recent thermal management techniques for microprocessors. In: ACM Computing Surveys. 2012 ; Vol. 44, No. 3.
@article{85da131c72b84a58a46d9ec8b51a53f3,
title = "Recent thermal management techniques for microprocessors",
abstract = "Microprocessor design has recently encountered many constraints such as power, energy, reliability, and temperature. Among these challenging issues, temperature-related issues have become especially important within the past several years. We summarize recent thermal management techniques for microprocessors, focusing on those that affect or rely on themicroarchitecture. We categorize thermal management techniques into sixmain categories: temperaturemonitoring, microarchitectural techniques, floorplanning, OS/compiler techniques, liquid cooling techniques, and thermal reliability/security. Temperature monitoring, a requirement for Dynamic Thermal Management (DTM), includes temperature estimation and sensor placement techniques for accurate temperature measurement or estimation. Microarchitectural techniques include both static and dynamic thermal management techniques that control hardware structures. Floorplanning covers a range of thermal-aware floorplanning techniques for 2D and 3D microprocessors. OS/compiler techniques include thermal-aware task scheduling and instruction scheduling techniques. Liquid cooling techniques are higher-capacity alternatives to conventional air cooling techniques. Thermal reliability/security issues cover temperature-dependent reliability modeling, Dynamic Reliability Management (DRM), and malicious codes that specifically cause overheating. Temperature-related issues will only become more challenging as process technology continues to evolve and transistor densities scale up faster than power per transistor scales down. The overall objective of this survey is to give microprocessor designers a broad perspective on various aspects of designing thermal-aware microprocessors and to guide future thermal management studies.",
keywords = "Microprocessor, Performance and reliability, Thermal management",
author = "Joonho Kong and Jung, {Sung Woo} and Kevin Skadron",
year = "2012",
month = "6",
day = "1",
doi = "10.1145/2187671.2187675",
language = "English",
volume = "44",
journal = "ACM Computing Surveys",
issn = "0360-0300",
publisher = "Association for Computing Machinery (ACM)",
number = "3",

}

TY - JOUR

T1 - Recent thermal management techniques for microprocessors

AU - Kong, Joonho

AU - Jung, Sung Woo

AU - Skadron, Kevin

PY - 2012/6/1

Y1 - 2012/6/1

N2 - Microprocessor design has recently encountered many constraints such as power, energy, reliability, and temperature. Among these challenging issues, temperature-related issues have become especially important within the past several years. We summarize recent thermal management techniques for microprocessors, focusing on those that affect or rely on themicroarchitecture. We categorize thermal management techniques into sixmain categories: temperaturemonitoring, microarchitectural techniques, floorplanning, OS/compiler techniques, liquid cooling techniques, and thermal reliability/security. Temperature monitoring, a requirement for Dynamic Thermal Management (DTM), includes temperature estimation and sensor placement techniques for accurate temperature measurement or estimation. Microarchitectural techniques include both static and dynamic thermal management techniques that control hardware structures. Floorplanning covers a range of thermal-aware floorplanning techniques for 2D and 3D microprocessors. OS/compiler techniques include thermal-aware task scheduling and instruction scheduling techniques. Liquid cooling techniques are higher-capacity alternatives to conventional air cooling techniques. Thermal reliability/security issues cover temperature-dependent reliability modeling, Dynamic Reliability Management (DRM), and malicious codes that specifically cause overheating. Temperature-related issues will only become more challenging as process technology continues to evolve and transistor densities scale up faster than power per transistor scales down. The overall objective of this survey is to give microprocessor designers a broad perspective on various aspects of designing thermal-aware microprocessors and to guide future thermal management studies.

AB - Microprocessor design has recently encountered many constraints such as power, energy, reliability, and temperature. Among these challenging issues, temperature-related issues have become especially important within the past several years. We summarize recent thermal management techniques for microprocessors, focusing on those that affect or rely on themicroarchitecture. We categorize thermal management techniques into sixmain categories: temperaturemonitoring, microarchitectural techniques, floorplanning, OS/compiler techniques, liquid cooling techniques, and thermal reliability/security. Temperature monitoring, a requirement for Dynamic Thermal Management (DTM), includes temperature estimation and sensor placement techniques for accurate temperature measurement or estimation. Microarchitectural techniques include both static and dynamic thermal management techniques that control hardware structures. Floorplanning covers a range of thermal-aware floorplanning techniques for 2D and 3D microprocessors. OS/compiler techniques include thermal-aware task scheduling and instruction scheduling techniques. Liquid cooling techniques are higher-capacity alternatives to conventional air cooling techniques. Thermal reliability/security issues cover temperature-dependent reliability modeling, Dynamic Reliability Management (DRM), and malicious codes that specifically cause overheating. Temperature-related issues will only become more challenging as process technology continues to evolve and transistor densities scale up faster than power per transistor scales down. The overall objective of this survey is to give microprocessor designers a broad perspective on various aspects of designing thermal-aware microprocessors and to guide future thermal management studies.

KW - Microprocessor

KW - Performance and reliability

KW - Thermal management

UR - http://www.scopus.com/inward/record.url?scp=84863832368&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84863832368&partnerID=8YFLogxK

U2 - 10.1145/2187671.2187675

DO - 10.1145/2187671.2187675

M3 - Article

AN - SCOPUS:84863832368

VL - 44

JO - ACM Computing Surveys

JF - ACM Computing Surveys

SN - 0360-0300

IS - 3

M1 - 13

ER -