Abstract
Semiconductors performing digital clocking are a main source of radiated emission noise. Therefore, the most secure method of reducing emission noise is to reduce emission radiated from semiconductors; an application of an absorber to the surface of semiconductors is one of these methods, too. However, in reality, it is difficult to achieve as much effect of noise reduction as expected by using only absorber. It is confirmed by experiment in this paper that a loop area within chip has no correlation with radiated emission noise and it is clarified why the existing absorber fails to achieve a satisfactory effect of emission noise reduction. Besides, a new type of chip coating absorber has been developed which can cover up to semiconductor out lead by using ferrite coating material of ferrite/epoxy acrylate substance using only permeability loss out of electronic wave reduction characteristics of materials. As a result of evaluating radiated emission noise by applying this coating absorber to semiconductor device, it could be confirmed that emission noise decreased from about 3 dB up to 20 dB depending on frequency.
| Original language | English |
|---|---|
| Pages (from-to) | 153-156 |
| Number of pages | 4 |
| Journal | IEEE International Symposium on Electromagnetic Compatibility |
| Volume | 1 |
| Publication status | Published - 2000 |
| Event | 2000 IEEE International Symposium on Electromagneti Compatibility - Washington, DC, USA Duration: 2000 Aug 21 → 2000 Aug 25 |
ASJC Scopus subject areas
- Condensed Matter Physics
- Electrical and Electronic Engineering