Abstract
Semiconductors performing digital clocking are a main source of radiated emission noise. Therefore, the most secure method of reducing emission noise is to reduce emission radiated from semiconductors; an application of an absorber to the surface of semiconductors is one of these methods, too. However, in reality, it is difficult to achieve as much effect of noise reduction as expected by using only absorber. It is confirmed by experiment in this paper that a loop area within chip has no correlation with radiated emission noise and it is clarified why the existing absorber fails to achieve a satisfactory effect of emission noise reduction. Besides, a new type of chip coating absorber has been developed which can cover up to semiconductor out lead by using ferrite coating material of ferrite/epoxy acrylate substance using only permeability loss out of electronic wave reduction characteristics of materials. As a result of evaluating radiated emission noise by applying this coating absorber to semiconductor device, it could be confirmed that emission noise decreased from about 3 dB up to 20 dB depending on frequency.
| Original language | English |
|---|---|
| Title of host publication | IEEE International Symposium on Electromagnetic Compatibility |
| Publisher | IEEE |
| Pages | 153-156 |
| Number of pages | 4 |
| Volume | 1 |
| Publication status | Published - 2000 |
| Externally published | Yes |
| Event | 2000 IEEE International Symposium on Electromagneti Compatibility - Washington, DC, USA Duration: 2000 Aug 21 → 2000 Aug 25 |
Other
| Other | 2000 IEEE International Symposium on Electromagneti Compatibility |
|---|---|
| City | Washington, DC, USA |
| Period | 00/8/21 → 00/8/25 |
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ASJC Scopus subject areas
- Electrical and Electronic Engineering
- Condensed Matter Physics
Cite this
Reduction of radiated emissions from semiconductor by using absorbent materials. / Kim, Soo hyung; Lee, Seung bae; Ouh, Kyung il; Rim, Chae bog; Moon, Kyoung sik; Yoon, Ho Gyu; Moon, Tak jin.
IEEE International Symposium on Electromagnetic Compatibility. Vol. 1 IEEE, 2000. p. 153-156.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - Reduction of radiated emissions from semiconductor by using absorbent materials
AU - Kim, Soo hyung
AU - Lee, Seung bae
AU - Ouh, Kyung il
AU - Rim, Chae bog
AU - Moon, Kyoung sik
AU - Yoon, Ho Gyu
AU - Moon, Tak jin
PY - 2000
Y1 - 2000
N2 - Semiconductors performing digital clocking are a main source of radiated emission noise. Therefore, the most secure method of reducing emission noise is to reduce emission radiated from semiconductors; an application of an absorber to the surface of semiconductors is one of these methods, too. However, in reality, it is difficult to achieve as much effect of noise reduction as expected by using only absorber. It is confirmed by experiment in this paper that a loop area within chip has no correlation with radiated emission noise and it is clarified why the existing absorber fails to achieve a satisfactory effect of emission noise reduction. Besides, a new type of chip coating absorber has been developed which can cover up to semiconductor out lead by using ferrite coating material of ferrite/epoxy acrylate substance using only permeability loss out of electronic wave reduction characteristics of materials. As a result of evaluating radiated emission noise by applying this coating absorber to semiconductor device, it could be confirmed that emission noise decreased from about 3 dB up to 20 dB depending on frequency.
AB - Semiconductors performing digital clocking are a main source of radiated emission noise. Therefore, the most secure method of reducing emission noise is to reduce emission radiated from semiconductors; an application of an absorber to the surface of semiconductors is one of these methods, too. However, in reality, it is difficult to achieve as much effect of noise reduction as expected by using only absorber. It is confirmed by experiment in this paper that a loop area within chip has no correlation with radiated emission noise and it is clarified why the existing absorber fails to achieve a satisfactory effect of emission noise reduction. Besides, a new type of chip coating absorber has been developed which can cover up to semiconductor out lead by using ferrite coating material of ferrite/epoxy acrylate substance using only permeability loss out of electronic wave reduction characteristics of materials. As a result of evaluating radiated emission noise by applying this coating absorber to semiconductor device, it could be confirmed that emission noise decreased from about 3 dB up to 20 dB depending on frequency.
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UR - http://www.scopus.com/inward/citedby.url?scp=0033712666&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:0033712666
VL - 1
SP - 153
EP - 156
BT - IEEE International Symposium on Electromagnetic Compatibility
PB - IEEE
ER -