Reliability assessment of MEMS structure of Su-8 thin film

Jun Hyub Park, Hak Joo Lee, Joong Hyok An, Hee Yuel Roh, Yun-Jae Kim, Sang Hyun Kim

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper describes new test method for obtaining static and dynamic characteristics of thin film and reliability evaluation method on MEMS device with thin film. The Su-8 is often used in micro-electro-mechanical systems devices. Durability should be ensured for such devices under cycling load. Therefore, with the proposed specimen and test procedure, tensile test was performed to obtain mechanical properties. The specimen was made with dimensions of 1000μm long, 9 and 11μm thickness, and 3 kinds of width, 50, 100 and 150μm. Behaviors of Su-8 have the 3 kinds of stress-strain curves. The mechanical characteristics of Su-8 were multiple, showing characteristics of brittle and ductile material and polymer. It was found that the mechanical properties of Su-8 did not have any effect on thickness. High cycle fatigue test was performed to obtain probability of failure at a given stress. We found that fatigue life of Su-8 was very susceptible to stress level and then strength-stress model was suitable for the assessment of durability of MEMS structure under cycling load.

Original languageEnglish
Title of host publicationProceedings of the International Conference on Integration and Commercialization of Micro and Nanosystems 2007
Pages495-500
Number of pages6
VolumeA
DOIs
Publication statusPublished - 2007 Aug 22
EventInternational Conference on Integration and Commercialization of Micro and Nanosystems 2007 - Sanya, Hainan, China
Duration: 2007 Jan 102007 Jan 13

Other

OtherInternational Conference on Integration and Commercialization of Micro and Nanosystems 2007
CountryChina
CitySanya, Hainan
Period07/1/1007/1/13

Fingerprint

MEMS
Thin films
Durability
Fatigue of materials
Mechanical properties
Stress-strain curves
Loads (forces)
Polymers

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

Cite this

Park, J. H., Lee, H. J., An, J. H., Roh, H. Y., Kim, Y-J., & Kim, S. H. (2007). Reliability assessment of MEMS structure of Su-8 thin film. In Proceedings of the International Conference on Integration and Commercialization of Micro and Nanosystems 2007 (Vol. A, pp. 495-500) https://doi.org/10.1115/MNC2007-21306

Reliability assessment of MEMS structure of Su-8 thin film. / Park, Jun Hyub; Lee, Hak Joo; An, Joong Hyok; Roh, Hee Yuel; Kim, Yun-Jae; Kim, Sang Hyun.

Proceedings of the International Conference on Integration and Commercialization of Micro and Nanosystems 2007. Vol. A 2007. p. 495-500.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Park, JH, Lee, HJ, An, JH, Roh, HY, Kim, Y-J & Kim, SH 2007, Reliability assessment of MEMS structure of Su-8 thin film. in Proceedings of the International Conference on Integration and Commercialization of Micro and Nanosystems 2007. vol. A, pp. 495-500, International Conference on Integration and Commercialization of Micro and Nanosystems 2007, Sanya, Hainan, China, 07/1/10. https://doi.org/10.1115/MNC2007-21306
Park JH, Lee HJ, An JH, Roh HY, Kim Y-J, Kim SH. Reliability assessment of MEMS structure of Su-8 thin film. In Proceedings of the International Conference on Integration and Commercialization of Micro and Nanosystems 2007. Vol. A. 2007. p. 495-500 https://doi.org/10.1115/MNC2007-21306
Park, Jun Hyub ; Lee, Hak Joo ; An, Joong Hyok ; Roh, Hee Yuel ; Kim, Yun-Jae ; Kim, Sang Hyun. / Reliability assessment of MEMS structure of Su-8 thin film. Proceedings of the International Conference on Integration and Commercialization of Micro and Nanosystems 2007. Vol. A 2007. pp. 495-500
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