Segmented dynamic time warping based signal pattern classification

Jae Yeol Hong, Seung Hwan Park, Jun Geol Baek

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The semiconductor manufacturing process is divided into fabrication process and packaging process. Fabrication process is a core process for manufacturing semiconductors and consists of about 700 unit processes. This unit process accumulates vast amounts of data, and many manufacturing companies apply data-based algorithms to manufacturing systems to improve process yield and quality. Data generated during the semiconductor manufacturing process from the process equipment is called fault detection and classification (FDC) trace data, and this data has time-series characteristics of different patterns depending on the sensor type or the recipe. Therefore, it is necessary to develop a classification algorithm appropriate to the signal pattern for process monitoring. In this paper, we develop segmented dynamic time warping technique which is specialized for process signal classification. Generally, it is known that dynamic time warping (DTW) has superior classification performance for time series data. However, there is a limit to classification that reflects the characteristics of semiconductor process signals. Therefore, we developed a classification algorithm for process signal data through segmented DTW using maximum overlap discrete wavelet transform (MODWT) and random sample consensus (RANSAC), and validated it.

Original languageEnglish
Title of host publicationProceedings - 22nd IEEE International Conference on Computational Science and Engineering and 17th IEEE International Conference on Embedded and Ubiquitous Computing, CSE/EUC 2019
EditorsMeikang Qiu
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages263-265
Number of pages3
ISBN (Electronic)9781728116631
DOIs
Publication statusPublished - 2019 Aug
Event22nd IEEE International Conference on Computational Science and Engineering and 17th IEEE International Conference on Embedded and Ubiquitous Computing, CSE/EUC 2019 - New York, United States
Duration: 2019 Aug 12019 Aug 3

Publication series

NameProceedings - 22nd IEEE International Conference on Computational Science and Engineering and 17th IEEE International Conference on Embedded and Ubiquitous Computing, CSE/EUC 2019

Conference

Conference22nd IEEE International Conference on Computational Science and Engineering and 17th IEEE International Conference on Embedded and Ubiquitous Computing, CSE/EUC 2019
CountryUnited States
CityNew York
Period19/8/119/8/3

Fingerprint

Pattern recognition
Semiconductor materials
Chemical reactions
Time series
Fabrication
Discrete wavelet transforms
Process monitoring
Fault detection
Packaging
Sensors
Industry

Keywords

  • -Fault-detection-and-classification-(FDC)
  • -Maximum-overlap-discrete-wavelet-transform-(MODWT)
  • -Random-sample-consensus-(RANSAC)
  • -Segmented-dynamic-time-warping-(SDTW)
  • -Semiconductor-manufacturing-process
  • Dynamic-time-warping-(DTW)

ASJC Scopus subject areas

  • Computer Networks and Communications
  • Computer Science Applications
  • Computer Vision and Pattern Recognition
  • Hardware and Architecture
  • Human-Computer Interaction
  • Artificial Intelligence

Cite this

Hong, J. Y., Park, S. H., & Baek, J. G. (2019). Segmented dynamic time warping based signal pattern classification. In M. Qiu (Ed.), Proceedings - 22nd IEEE International Conference on Computational Science and Engineering and 17th IEEE International Conference on Embedded and Ubiquitous Computing, CSE/EUC 2019 (pp. 263-265). [8919528] (Proceedings - 22nd IEEE International Conference on Computational Science and Engineering and 17th IEEE International Conference on Embedded and Ubiquitous Computing, CSE/EUC 2019). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/CSE/EUC.2019.00058

Segmented dynamic time warping based signal pattern classification. / Hong, Jae Yeol; Park, Seung Hwan; Baek, Jun Geol.

Proceedings - 22nd IEEE International Conference on Computational Science and Engineering and 17th IEEE International Conference on Embedded and Ubiquitous Computing, CSE/EUC 2019. ed. / Meikang Qiu. Institute of Electrical and Electronics Engineers Inc., 2019. p. 263-265 8919528 (Proceedings - 22nd IEEE International Conference on Computational Science and Engineering and 17th IEEE International Conference on Embedded and Ubiquitous Computing, CSE/EUC 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Hong, JY, Park, SH & Baek, JG 2019, Segmented dynamic time warping based signal pattern classification. in M Qiu (ed.), Proceedings - 22nd IEEE International Conference on Computational Science and Engineering and 17th IEEE International Conference on Embedded and Ubiquitous Computing, CSE/EUC 2019., 8919528, Proceedings - 22nd IEEE International Conference on Computational Science and Engineering and 17th IEEE International Conference on Embedded and Ubiquitous Computing, CSE/EUC 2019, Institute of Electrical and Electronics Engineers Inc., pp. 263-265, 22nd IEEE International Conference on Computational Science and Engineering and 17th IEEE International Conference on Embedded and Ubiquitous Computing, CSE/EUC 2019, New York, United States, 19/8/1. https://doi.org/10.1109/CSE/EUC.2019.00058
Hong JY, Park SH, Baek JG. Segmented dynamic time warping based signal pattern classification. In Qiu M, editor, Proceedings - 22nd IEEE International Conference on Computational Science and Engineering and 17th IEEE International Conference on Embedded and Ubiquitous Computing, CSE/EUC 2019. Institute of Electrical and Electronics Engineers Inc. 2019. p. 263-265. 8919528. (Proceedings - 22nd IEEE International Conference on Computational Science and Engineering and 17th IEEE International Conference on Embedded and Ubiquitous Computing, CSE/EUC 2019). https://doi.org/10.1109/CSE/EUC.2019.00058
Hong, Jae Yeol ; Park, Seung Hwan ; Baek, Jun Geol. / Segmented dynamic time warping based signal pattern classification. Proceedings - 22nd IEEE International Conference on Computational Science and Engineering and 17th IEEE International Conference on Embedded and Ubiquitous Computing, CSE/EUC 2019. editor / Meikang Qiu. Institute of Electrical and Electronics Engineers Inc., 2019. pp. 263-265 (Proceedings - 22nd IEEE International Conference on Computational Science and Engineering and 17th IEEE International Conference on Embedded and Ubiquitous Computing, CSE/EUC 2019).
@inproceedings{ea214c52e5ec4a68adf0c61f27b829e1,
title = "Segmented dynamic time warping based signal pattern classification",
abstract = "The semiconductor manufacturing process is divided into fabrication process and packaging process. Fabrication process is a core process for manufacturing semiconductors and consists of about 700 unit processes. This unit process accumulates vast amounts of data, and many manufacturing companies apply data-based algorithms to manufacturing systems to improve process yield and quality. Data generated during the semiconductor manufacturing process from the process equipment is called fault detection and classification (FDC) trace data, and this data has time-series characteristics of different patterns depending on the sensor type or the recipe. Therefore, it is necessary to develop a classification algorithm appropriate to the signal pattern for process monitoring. In this paper, we develop segmented dynamic time warping technique which is specialized for process signal classification. Generally, it is known that dynamic time warping (DTW) has superior classification performance for time series data. However, there is a limit to classification that reflects the characteristics of semiconductor process signals. Therefore, we developed a classification algorithm for process signal data through segmented DTW using maximum overlap discrete wavelet transform (MODWT) and random sample consensus (RANSAC), and validated it.",
keywords = "-Fault-detection-and-classification-(FDC), -Maximum-overlap-discrete-wavelet-transform-(MODWT), -Random-sample-consensus-(RANSAC), -Segmented-dynamic-time-warping-(SDTW), -Semiconductor-manufacturing-process, Dynamic-time-warping-(DTW)",
author = "Hong, {Jae Yeol} and Park, {Seung Hwan} and Baek, {Jun Geol}",
year = "2019",
month = "8",
doi = "10.1109/CSE/EUC.2019.00058",
language = "English",
series = "Proceedings - 22nd IEEE International Conference on Computational Science and Engineering and 17th IEEE International Conference on Embedded and Ubiquitous Computing, CSE/EUC 2019",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "263--265",
editor = "Meikang Qiu",
booktitle = "Proceedings - 22nd IEEE International Conference on Computational Science and Engineering and 17th IEEE International Conference on Embedded and Ubiquitous Computing, CSE/EUC 2019",

}

TY - GEN

T1 - Segmented dynamic time warping based signal pattern classification

AU - Hong, Jae Yeol

AU - Park, Seung Hwan

AU - Baek, Jun Geol

PY - 2019/8

Y1 - 2019/8

N2 - The semiconductor manufacturing process is divided into fabrication process and packaging process. Fabrication process is a core process for manufacturing semiconductors and consists of about 700 unit processes. This unit process accumulates vast amounts of data, and many manufacturing companies apply data-based algorithms to manufacturing systems to improve process yield and quality. Data generated during the semiconductor manufacturing process from the process equipment is called fault detection and classification (FDC) trace data, and this data has time-series characteristics of different patterns depending on the sensor type or the recipe. Therefore, it is necessary to develop a classification algorithm appropriate to the signal pattern for process monitoring. In this paper, we develop segmented dynamic time warping technique which is specialized for process signal classification. Generally, it is known that dynamic time warping (DTW) has superior classification performance for time series data. However, there is a limit to classification that reflects the characteristics of semiconductor process signals. Therefore, we developed a classification algorithm for process signal data through segmented DTW using maximum overlap discrete wavelet transform (MODWT) and random sample consensus (RANSAC), and validated it.

AB - The semiconductor manufacturing process is divided into fabrication process and packaging process. Fabrication process is a core process for manufacturing semiconductors and consists of about 700 unit processes. This unit process accumulates vast amounts of data, and many manufacturing companies apply data-based algorithms to manufacturing systems to improve process yield and quality. Data generated during the semiconductor manufacturing process from the process equipment is called fault detection and classification (FDC) trace data, and this data has time-series characteristics of different patterns depending on the sensor type or the recipe. Therefore, it is necessary to develop a classification algorithm appropriate to the signal pattern for process monitoring. In this paper, we develop segmented dynamic time warping technique which is specialized for process signal classification. Generally, it is known that dynamic time warping (DTW) has superior classification performance for time series data. However, there is a limit to classification that reflects the characteristics of semiconductor process signals. Therefore, we developed a classification algorithm for process signal data through segmented DTW using maximum overlap discrete wavelet transform (MODWT) and random sample consensus (RANSAC), and validated it.

KW - -Fault-detection-and-classification-(FDC)

KW - -Maximum-overlap-discrete-wavelet-transform-(MODWT)

KW - -Random-sample-consensus-(RANSAC)

KW - -Segmented-dynamic-time-warping-(SDTW)

KW - -Semiconductor-manufacturing-process

KW - Dynamic-time-warping-(DTW)

UR - http://www.scopus.com/inward/record.url?scp=85077035687&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85077035687&partnerID=8YFLogxK

U2 - 10.1109/CSE/EUC.2019.00058

DO - 10.1109/CSE/EUC.2019.00058

M3 - Conference contribution

AN - SCOPUS:85077035687

T3 - Proceedings - 22nd IEEE International Conference on Computational Science and Engineering and 17th IEEE International Conference on Embedded and Ubiquitous Computing, CSE/EUC 2019

SP - 263

EP - 265

BT - Proceedings - 22nd IEEE International Conference on Computational Science and Engineering and 17th IEEE International Conference on Embedded and Ubiquitous Computing, CSE/EUC 2019

A2 - Qiu, Meikang

PB - Institute of Electrical and Electronics Engineers Inc.

ER -