The etching selectivity between SrBi2Ta2O (SBT) and CeO2 films was investigated. The study was carried out by optimizing gas mixture of Ar and Cl2, the inductively coupled plasma (ICP) power and the rf bias power in the ICP-reactive ion etching (RIE) system. It was found that the ion etching selectivity of SBT/CeO2 was 6.8 and the vertical etching angle of SBT was 82° at the condition of 50% Cl 2 concentration. It was also observed that the etch rates of the HfO based dielectric films appear to depend on etch properties of each phase in the films.
|Number of pages||5|
|Journal||Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films|
|Publication status||Published - 2004 Jul|
ASJC Scopus subject areas
- Condensed Matter Physics
- Surfaces and Interfaces
- Surfaces, Coatings and Films