Self-arrangement of solder balls by using the surface wettability difference

Jong hyeon Chang, Jangwon Hong, James Jungho Pak

Research output: Contribution to journalArticle

3 Citations (Scopus)

Abstract

This letter describes a simple and efficient method of the solder ball placement for electronic packaging. For self-arranging solder balls by using the surface wettability difference, the substrate surface was patterned into the hydrophilic Au solder ball land array with the hydrophobic Teflon passivation layer. Water droplets were formed only on the solder ball lands after dipping the patterned substrate into water. Then, the solder balls were placed on each of the wetted solder ball lands. After soldering two plates with 3 × 3, 4 × 4, and 5 × 5 arrayed solder balls, their average shear strengths were as high as 195, 220, and 251 MPa, respectively.

Original languageEnglish
Pages (from-to)1283-1286
Number of pages4
JournalMaterials Letters
Volume64
Issue number11
DOIs
Publication statusPublished - 2010 Jun 15

Fingerprint

solders
wettability
Soldering alloys
Wetting
balls
electronic packaging
Electronics packaging
soldering
Water
teflon (trademark)
shear strength
Soldering
Polytetrafluoroethylene
Substrates
dipping
Polytetrafluoroethylenes
Passivation
Shear strength
water
passivity

Keywords

  • Self-arrangement
  • Solder balls
  • Surface wettability

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanical Engineering
  • Mechanics of Materials

Cite this

Self-arrangement of solder balls by using the surface wettability difference. / Chang, Jong hyeon; Hong, Jangwon; Pak, James Jungho.

In: Materials Letters, Vol. 64, No. 11, 15.06.2010, p. 1283-1286.

Research output: Contribution to journalArticle

Chang, Jong hyeon ; Hong, Jangwon ; Pak, James Jungho. / Self-arrangement of solder balls by using the surface wettability difference. In: Materials Letters. 2010 ; Vol. 64, No. 11. pp. 1283-1286.
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