Self-assembled block copolymer micelles with silver-carbon nanotube hybrid fillers for high performance thermal conduction

Jae Ryung Choi, Seunggun Yu, Haejong Jung, Sun Kak Hwang, Richard Hahnkee Kim, Giyoung Song, Sung Hwan Cho, Insung Bae, Soon Man Hong, Chong Min Koo, Cheolmin Park

Research output: Contribution to journalArticle

11 Citations (Scopus)

Abstract

The development of polymer-filled composites with an extremely high thermal conductivity (TC) that is competitive with conventional metals is in great demand due to their cost-effective process, light weight, and easy shape-forming capability. A novel polymer composite with a large thermal conductivity of 153 W m -1 K -1 was prepared based on self-assembled block copolymer micelles containing two different fillers of micron-sized silver particles and multi-walled carbon nanotubes. Simple mechanical mixing of the components followed by conventional thermal compression at a low processing temperature of 160°C produced a novel composite with both structural and thermal stability that is durable for high temperature operation up to 150°C as well as multiple heating and cooling cycles of ΔT = 100°C. The high performance in thermal conduction of our composite was mainly attributed to the facile deformation of Ag particles during the mixing in a viscous thermoplastic medium, combined with networked carbon nanotubes uniformly dispersed in the nanoscale structural matrix of block copolymer micelles responsible for its high temperature mechanical stability. Furthermore, micro-imprinting on the composite allowed for topographically periodic surface micropatterns, which offers broader suitability for numerous micro-opto-electronic systems.

Original languageEnglish
Pages (from-to)1888-1895
Number of pages8
JournalNanoscale
Volume7
Issue number5
DOIs
Publication statusPublished - 2015 Feb 7
Externally publishedYes

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Carbon Nanotubes
Micelles
Silver
Block copolymers
Fillers
Carbon nanotubes
Composite materials
Thermal conductivity
High temperature operations
Filled polymers
Mechanical stability
Thermoplastics
Polymers
Thermodynamic stability
Metals
Hot Temperature
Cooling
Heating
Temperature
Processing

ASJC Scopus subject areas

  • Materials Science(all)

Cite this

Self-assembled block copolymer micelles with silver-carbon nanotube hybrid fillers for high performance thermal conduction. / Choi, Jae Ryung; Yu, Seunggun; Jung, Haejong; Hwang, Sun Kak; Kim, Richard Hahnkee; Song, Giyoung; Cho, Sung Hwan; Bae, Insung; Hong, Soon Man; Koo, Chong Min; Park, Cheolmin.

In: Nanoscale, Vol. 7, No. 5, 07.02.2015, p. 1888-1895.

Research output: Contribution to journalArticle

Choi, JR, Yu, S, Jung, H, Hwang, SK, Kim, RH, Song, G, Cho, SH, Bae, I, Hong, SM, Koo, CM & Park, C 2015, 'Self-assembled block copolymer micelles with silver-carbon nanotube hybrid fillers for high performance thermal conduction', Nanoscale, vol. 7, no. 5, pp. 1888-1895. https://doi.org/10.1039/c4nr06390b
Choi, Jae Ryung ; Yu, Seunggun ; Jung, Haejong ; Hwang, Sun Kak ; Kim, Richard Hahnkee ; Song, Giyoung ; Cho, Sung Hwan ; Bae, Insung ; Hong, Soon Man ; Koo, Chong Min ; Park, Cheolmin. / Self-assembled block copolymer micelles with silver-carbon nanotube hybrid fillers for high performance thermal conduction. In: Nanoscale. 2015 ; Vol. 7, No. 5. pp. 1888-1895.
@article{723a1784243e4a41b87239c423d3fb47,
title = "Self-assembled block copolymer micelles with silver-carbon nanotube hybrid fillers for high performance thermal conduction",
abstract = "The development of polymer-filled composites with an extremely high thermal conductivity (TC) that is competitive with conventional metals is in great demand due to their cost-effective process, light weight, and easy shape-forming capability. A novel polymer composite with a large thermal conductivity of 153 W m -1 K -1 was prepared based on self-assembled block copolymer micelles containing two different fillers of micron-sized silver particles and multi-walled carbon nanotubes. Simple mechanical mixing of the components followed by conventional thermal compression at a low processing temperature of 160°C produced a novel composite with both structural and thermal stability that is durable for high temperature operation up to 150°C as well as multiple heating and cooling cycles of ΔT = 100°C. The high performance in thermal conduction of our composite was mainly attributed to the facile deformation of Ag particles during the mixing in a viscous thermoplastic medium, combined with networked carbon nanotubes uniformly dispersed in the nanoscale structural matrix of block copolymer micelles responsible for its high temperature mechanical stability. Furthermore, micro-imprinting on the composite allowed for topographically periodic surface micropatterns, which offers broader suitability for numerous micro-opto-electronic systems.",
author = "Choi, {Jae Ryung} and Seunggun Yu and Haejong Jung and Hwang, {Sun Kak} and Kim, {Richard Hahnkee} and Giyoung Song and Cho, {Sung Hwan} and Insung Bae and Hong, {Soon Man} and Koo, {Chong Min} and Cheolmin Park",
year = "2015",
month = "2",
day = "7",
doi = "10.1039/c4nr06390b",
language = "English",
volume = "7",
pages = "1888--1895",
journal = "Nanoscale",
issn = "2040-3364",
publisher = "Royal Society of Chemistry",
number = "5",

}

TY - JOUR

T1 - Self-assembled block copolymer micelles with silver-carbon nanotube hybrid fillers for high performance thermal conduction

AU - Choi, Jae Ryung

AU - Yu, Seunggun

AU - Jung, Haejong

AU - Hwang, Sun Kak

AU - Kim, Richard Hahnkee

AU - Song, Giyoung

AU - Cho, Sung Hwan

AU - Bae, Insung

AU - Hong, Soon Man

AU - Koo, Chong Min

AU - Park, Cheolmin

PY - 2015/2/7

Y1 - 2015/2/7

N2 - The development of polymer-filled composites with an extremely high thermal conductivity (TC) that is competitive with conventional metals is in great demand due to their cost-effective process, light weight, and easy shape-forming capability. A novel polymer composite with a large thermal conductivity of 153 W m -1 K -1 was prepared based on self-assembled block copolymer micelles containing two different fillers of micron-sized silver particles and multi-walled carbon nanotubes. Simple mechanical mixing of the components followed by conventional thermal compression at a low processing temperature of 160°C produced a novel composite with both structural and thermal stability that is durable for high temperature operation up to 150°C as well as multiple heating and cooling cycles of ΔT = 100°C. The high performance in thermal conduction of our composite was mainly attributed to the facile deformation of Ag particles during the mixing in a viscous thermoplastic medium, combined with networked carbon nanotubes uniformly dispersed in the nanoscale structural matrix of block copolymer micelles responsible for its high temperature mechanical stability. Furthermore, micro-imprinting on the composite allowed for topographically periodic surface micropatterns, which offers broader suitability for numerous micro-opto-electronic systems.

AB - The development of polymer-filled composites with an extremely high thermal conductivity (TC) that is competitive with conventional metals is in great demand due to their cost-effective process, light weight, and easy shape-forming capability. A novel polymer composite with a large thermal conductivity of 153 W m -1 K -1 was prepared based on self-assembled block copolymer micelles containing two different fillers of micron-sized silver particles and multi-walled carbon nanotubes. Simple mechanical mixing of the components followed by conventional thermal compression at a low processing temperature of 160°C produced a novel composite with both structural and thermal stability that is durable for high temperature operation up to 150°C as well as multiple heating and cooling cycles of ΔT = 100°C. The high performance in thermal conduction of our composite was mainly attributed to the facile deformation of Ag particles during the mixing in a viscous thermoplastic medium, combined with networked carbon nanotubes uniformly dispersed in the nanoscale structural matrix of block copolymer micelles responsible for its high temperature mechanical stability. Furthermore, micro-imprinting on the composite allowed for topographically periodic surface micropatterns, which offers broader suitability for numerous micro-opto-electronic systems.

UR - http://www.scopus.com/inward/record.url?scp=84921727847&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84921727847&partnerID=8YFLogxK

U2 - 10.1039/c4nr06390b

DO - 10.1039/c4nr06390b

M3 - Article

VL - 7

SP - 1888

EP - 1895

JO - Nanoscale

JF - Nanoscale

SN - 2040-3364

IS - 5

ER -