Abstract
We discuss the SiGe HBT structural changes required for very high performance. The increase in collector concentration, affecting current density and avalanche current, appears to be the most fundamental concern for reliability. In device design, a narrow emitter and reduced poly-single-crystal interfacial oxide are important elements in minimizing device parameter shifts. From the application point of view, avalanche hot-carriers appear to present new constraints, which may be managed through limiting voltage (to 1.5X-2X BVCEOi), or through circuit designs robust to base current parameter shifts.
Original language | English |
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Pages (from-to) | 332-338 |
Number of pages | 7 |
Journal | Annual Proceedings - Reliability Physics (Symposium) |
Publication status | Published - 2003 |
Externally published | Yes |
Event | 2003 IEEE International Reliability Physics Symposium Proceedings - Dallas, TX, United States Duration: 2003 Mar 30 → 2003 Apr 4 |
Keywords
- Avalanche
- Device Scaling
- SiGe HBT
- Thermal
ASJC Scopus subject areas
- Electrical and Electronic Engineering
- Safety, Risk, Reliability and Quality