Simple signal path technique for matching circuit in packaged semiconductor diode laser

Research output: Contribution to journalArticle

Abstract

Improvement in frequency bandwidth of a packaged diode laser is investigated by the circuit impedance matching. To overcome the structural limitation of the electronic package for high frequencies, employing conventional lumped element impedance matching technique in conjunction with the manipulation of signal path of the package connections showed significant enhancement for 3-dB bandwidth to more than 6 GHz.

Original languageEnglish
Pages (from-to)185-188
Number of pages4
JournalOpto-electronics Review
Volume16
Issue number2
DOIs
Publication statusPublished - 2008 Mar
Externally publishedYes

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Keywords

  • Bandwidth
  • Circuit modelling
  • Device packaging
  • Diode laser
  • Frequency response

ASJC Scopus subject areas

  • Radiation
  • Materials Science(all)
  • Electrical and Electronic Engineering

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