TY - GEN
T1 - Small-area high-accuracy ODT/OCD by calibration of global on-chip for 512M GDDR5 application
AU - Koo, Jabeom
AU - Kim, Gil Su
AU - Song, Junyoung
AU - Kim, Kwan Weon
AU - Choi, Young Jung
AU - Kim, Chulwoo
PY - 2009
Y1 - 2009
N2 - The proposed on-die termination (ODT) calibration method is implemented by using a 0.18um CMOS technology. The proposed ODT can detect the impedance variations of each ODT/OCD independently with the help of the proposed local PVT variation sensor and can decrease the impedance mismatch error lower than 1% by calibration of global on-chip variation with small area overhead. The measured eye diagram area at 2Gbps is widened by 26% when the ODT is on. The random data rate used for testing the eye diagram is 2Gbps. The global impedance mismatch error is within 1% under the supply voltage variation from 1.7V to 1.9V. The ODT and its calibration circuit occupy 0.003mm2 and 0.015mm2, respectively. The power consumption of the calibration circuit is 10mW at 2Gbps.
AB - The proposed on-die termination (ODT) calibration method is implemented by using a 0.18um CMOS technology. The proposed ODT can detect the impedance variations of each ODT/OCD independently with the help of the proposed local PVT variation sensor and can decrease the impedance mismatch error lower than 1% by calibration of global on-chip variation with small area overhead. The measured eye diagram area at 2Gbps is widened by 26% when the ODT is on. The random data rate used for testing the eye diagram is 2Gbps. The global impedance mismatch error is within 1% under the supply voltage variation from 1.7V to 1.9V. The ODT and its calibration circuit occupy 0.003mm2 and 0.015mm2, respectively. The power consumption of the calibration circuit is 10mW at 2Gbps.
UR - http://www.scopus.com/inward/record.url?scp=74049133976&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=74049133976&partnerID=8YFLogxK
U2 - 10.1109/CICC.2009.5280735
DO - 10.1109/CICC.2009.5280735
M3 - Conference contribution
AN - SCOPUS:74049133976
SN - 9781424440726
T3 - Proceedings of the Custom Integrated Circuits Conference
SP - 717
EP - 720
BT - 2009 IEEE Custom Integrated Circuits Conference, CICC '09
T2 - 2009 IEEE Custom Integrated Circuits Conference, CICC '09
Y2 - 13 September 2009 through 16 September 2009
ER -