Solder bump creation by using droplet microgripper for electronic packaging

S. Y. Lee, J. H. Chang, D. Kim, B. K. Ju, J. J. Pak

Research output: Contribution to journalArticlepeer-review

3 Citations (Scopus)

Abstract

A simple and effective method to create solder bumps by using a droplet microgripper for electronic packaging is described. A reusable droplet microgripper was realised simply by patterning a Teflon amorphous fluoropolymer on a glass substrate to make a 5×5 hydrophilic opening site array of 300m-diameter circles and 600m pitches. The microgripper was used to self-arrange solder balls of 300m diameter on its wetted sites. After transferring the solder balls to a flux-coated soldering substrate by an alignment process, solder bumps were successfully created on the corresponding solder ball lands through a reflow process.

Original languageEnglish
Pages (from-to)1336-1338
Number of pages3
JournalElectronics Letters
Volume46
Issue number19
DOIs
Publication statusPublished - 2010 Sep 16

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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