Soldering-based easy packaging of thin polyimide multichannel electrodes for neuro-signal recording

Dong Hyun Baek, Chang Hee Han, Ha Chul Jung, Seon Min Kim, Chang Hwan Im, Hyun Jik Oh, James Jungho Pak, Sang Hoon Lee

Research output: Contribution to journalArticle

9 Citations (Scopus)

Abstract

We propose a novel packaging method for preparing thin polyimide (PI) multichannel microelectrodes. The electrodes were connected simply by making a via-hole at the interconnection pad of a thin PI electrode, and a nickel (Ni) ring was constructed by electroplating through the via-hole to permit stable soldering with strong adhesion to the electrode and the printed circuit board. The electroplating conditions were optimized for the construction of a well-organized Ni ring. The electrical properties of the packaged electrode were evaluated by fabricating and packaging a 40-channel thin PI electrode. Animal experiments were performed using the packaged electrode for high-resolution recording of somatosensory evoked potential from the skull of a rat. The in vivo and in vitro tests demonstrated that the packaged PI electrode may be used broadly for the continuous measurement of bio-signals or for neural prosthetics.

Original languageEnglish
Article number115017
JournalJournal of Micromechanics and Microengineering
Volume22
Issue number11
DOIs
Publication statusPublished - 2012 Nov 1

Fingerprint

Soldering
Polyimides
Packaging
Electrodes
Electroplating
Nickel
Microelectrodes
Bioelectric potentials
Prosthetics
Printed circuit boards
Rats
Animals
Electric properties
Adhesion

ASJC Scopus subject areas

  • Mechanical Engineering
  • Electrical and Electronic Engineering
  • Mechanics of Materials
  • Electronic, Optical and Magnetic Materials

Cite this

Soldering-based easy packaging of thin polyimide multichannel electrodes for neuro-signal recording. / Baek, Dong Hyun; Han, Chang Hee; Jung, Ha Chul; Kim, Seon Min; Im, Chang Hwan; Oh, Hyun Jik; Pak, James Jungho; Lee, Sang Hoon.

In: Journal of Micromechanics and Microengineering, Vol. 22, No. 11, 115017, 01.11.2012.

Research output: Contribution to journalArticle

Baek, Dong Hyun ; Han, Chang Hee ; Jung, Ha Chul ; Kim, Seon Min ; Im, Chang Hwan ; Oh, Hyun Jik ; Pak, James Jungho ; Lee, Sang Hoon. / Soldering-based easy packaging of thin polyimide multichannel electrodes for neuro-signal recording. In: Journal of Micromechanics and Microengineering. 2012 ; Vol. 22, No. 11.
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