Solid-state interaction between Ni and Cu for ternary compound growth in Ni/Sn/Cu diffusion couple

J. B. Ryu, J. Y. Huh, H. S. Kim, S. J. Oh

Research output: Contribution to journalConference article

Abstract

The solid-state interaction between Ni and Cu in an Ni/Sn/Cu diffusion couple, which served as a representative of the BGA solder joints of the Ni/Au finished component and the OSP finished board, was investigated during isothermal aging at 200 °C for aging times of up to 100 h. The Ni/Sn/Cu diffusion couple was prepared by sequentially depositing Sn (60 μm) and Ni (2 or 4 μm) on a Cu plate using the electroplating method. During the solid-state aging process, two distinct layers composed of (Cu 1-xNix)6Sn5 and (Cu 1-yNiy)6Sn5, respectively, which differed in their Ni concentrations, were formed at the Ni/Sn interface, and the ternary IMC grew rapidly by incorporating the Cu originating from the Cu plate. However, no detectable Ni diffusion occurred across the Sn layer. The results of this study show that the dominant Cu source for the solid-state growth of the ternary IMC at the Ni/Au finished component side in the BGA solder joints was the Cu bonding pad of the PCB, rather than the Cu dissolved into the solder during the reflow process.

Original languageEnglish
Pages (from-to)604-608
Number of pages5
JournalAdvanced Materials Research
Volume15-17
Publication statusPublished - 2007
Event5th International Conference on Processing and Manufacturing of Advanced Materials - THERMEC 2006 - Vancouver, BC, Canada
Duration: 2006 Jul 42006 Jul 8

Keywords

  • BGA packaging
  • Solder joint
  • Solid-state diffusion
  • Surface finish
  • Ternary intermetallic compound

ASJC Scopus subject areas

  • Engineering(all)

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