Solid-state interaction between Ni and Cu for ternary compound growth in Ni/Sn/Cu diffusion couple

J. B. Ryu, J. Y. Huh, H. S. Kim, S. J. Oh

Research output: Contribution to journalConference article

Fingerprint Dive into the research topics of 'Solid-state interaction between Ni and Cu for ternary compound growth in Ni/Sn/Cu diffusion couple'. Together they form a unique fingerprint.

Engineering & Materials Science