Source/drain contact resistance reduction through Al-doped ZnO interlayer to metal-interlayer-GaAs contact structure

Seung Hwan Kim; Gwang Sik Kim; Sun Woo Kim; Hyun-Yong Yu

doi:10.1149/07204.0321ecst

Source/drain contact resistance reduction through Al-doped ZnO interlayer to metal-interlayer-GaAs contact structure

Seung Hwan Kim, Gwang Sik Kim, Sun Woo Kim, Hyun-Yong Yu

School of Electrical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

We demonstrate a metal-interlayer-semiconductor structure for a non-alloyed source/drain ohmic contact by using a heavily doped ZnO. Therefore, the Fermi-level is effectively alleviated by preventing the metal induced gap state. Finally, we achieved ∼10⁵ x reduction of specific contact resistivity compared to the metal-semiconductor contact. For this reasons, the proposed contact is a promising non-alloyed source/drain ohmic contact for III-V semiconductor based devices.

Original language	English
Title of host publication	Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications 6
Publisher	Electrochemical Society Inc.
Pages	321-323
Number of pages	3
Volume	72
Edition	4
ISBN (Electronic)	9781607685395
DOIs	https://doi.org/10.1149/07204.0321ecst
Publication status	Published - 2016
Event	Symposium on Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications 6 - 229th ECS Meeting - San Diego, United States Duration: 2016 May 29 → 2016 Jun 2

Other

Other	Symposium on Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications 6 - 229th ECS Meeting
Country	United States
City	San Diego
Period	16/5/29 → 16/6/2

ASJC Scopus subject areas

Engineering(all)

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10.1149/07204.0321ecst

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Kim, S. H., Kim, G. S., Kim, S. W., & Yu, H-Y. (2016). Source/drain contact resistance reduction through Al-doped ZnO interlayer to metal-interlayer-GaAs contact structure. In Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications 6 (4 ed., Vol. 72, pp. 321-323). Electrochemical Society Inc.. https://doi.org/10.1149/07204.0321ecst

Source/drain contact resistance reduction through Al-doped ZnO interlayer to metal-interlayer-GaAs contact structure. / Kim, Seung Hwan; Kim, Gwang Sik; Kim, Sun Woo; Yu, Hyun-Yong.

Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications 6. Vol. 72 4. ed. Electrochemical Society Inc., 2016. p. 321-323.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Kim, SH, Kim, GS, Kim, SW & Yu, H-Y 2016, Source/drain contact resistance reduction through Al-doped ZnO interlayer to metal-interlayer-GaAs contact structure. in Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications 6. 4 edn, vol. 72, Electrochemical Society Inc., pp. 321-323, Symposium on Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications 6 - 229th ECS Meeting, San Diego, United States, 16/5/29. https://doi.org/10.1149/07204.0321ecst

Kim SH, Kim GS, Kim SW, Yu H-Y. Source/drain contact resistance reduction through Al-doped ZnO interlayer to metal-interlayer-GaAs contact structure. In Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications 6. 4 ed. Vol. 72. Electrochemical Society Inc. 2016. p. 321-323 https://doi.org/10.1149/07204.0321ecst

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