Space charge distributions in EPDM compounds

Kwang Suck Suh, S. K. Park, C. H. Lee, S. W. Kim, S. O. Han

Research output: Contribution to journalArticle

9 Citations (Scopus)

Abstract

The formation of space charge in EPDM (ethylene-propylene-diene terpolymer) filled with ATH (alumina trihydrate) or clay has been investigated by measuring charge distributions. It is found that the type and amount of space charge developed in crosslinked EPDM or its compounds is governed by the type of diene in EPDM and the composition of the semicon electrodes. The amount of charge in the EPDM compounds containing 1,4-hexadiene decreases with an increase of ATH content and increases with an increase of clay content. The heat treatment of EPDM compounds in a vacuum oven increases the amount of space charge in them. These features were explained by the effects of low molecular weight molecules present at the surface of fillers. It is found that the homocharge increases as the clay content increases, while EVA decreases the homocharge in the EPDM compounds. Possible reasons for these results are discussed.

Original languageEnglish
Pages (from-to)725-731
Number of pages7
JournalIEEE Transactions on Dielectrics and Electrical Insulation
Volume4
Issue number6
DOIs
Publication statusPublished - 1997 Dec 1

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Terpolymers
Charge distribution
Electric space charge
Propylene
Ethylene
Hydrated alumina
Clay
Ovens
Fillers
Molecular weight
Heat treatment
Vacuum
Electrodes
Molecules
Chemical analysis

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Space charge distributions in EPDM compounds. / Suh, Kwang Suck; Park, S. K.; Lee, C. H.; Kim, S. W.; Han, S. O.

In: IEEE Transactions on Dielectrics and Electrical Insulation, Vol. 4, No. 6, 01.12.1997, p. 725-731.

Research output: Contribution to journalArticle

Suh, Kwang Suck ; Park, S. K. ; Lee, C. H. ; Kim, S. W. ; Han, S. O. / Space charge distributions in EPDM compounds. In: IEEE Transactions on Dielectrics and Electrical Insulation. 1997 ; Vol. 4, No. 6. pp. 725-731.
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