Spatio-spectral filters for improving the classification of single trial EEG

Steven Lemm, Benjamin Blankertz, Gabriel Curio, Klaus Muller

Research output: Contribution to journalArticle

378 Citations (Scopus)

Abstract

Data recorded in electroencephalogram (EEG)-based brain-computer interface experiments is generally very noisy, non-stationary, and contaminated with artifacts that can deteriorate discrimination/classification methods. In this paper, we extend the common spatial pattern (CSP) algorithm with the aim to alleviate these adverse effects. In particular, we suggest an extension of CSP to the state space, which utilizes the method of time delay embedding. As we will show, this allows for individually tuned frequency filters at each electrode position and, thus, yields an improved and more robust machine learning procedure. The advantages of the proposed method over the original CSP method are verified in terms of an improved information transfer rate (bits per trial) on a set of EEG-recordings from experiments of imagined limb movements.

Original languageEnglish
Pages (from-to)1541-1548
Number of pages8
JournalIEEE Transactions on Biomedical Engineering
Volume52
Issue number9
DOIs
Publication statusPublished - 2005 Sep 1
Externally publishedYes

Fingerprint

Electroencephalography
Brain computer interface
Learning systems
Time delay
Experiments
Electrodes
Brain-Computer Interfaces
Artifacts
Extremities

Keywords

  • BCI
  • Classification
  • CSP
  • Feature extraction

ASJC Scopus subject areas

  • Biomedical Engineering

Cite this

Spatio-spectral filters for improving the classification of single trial EEG. / Lemm, Steven; Blankertz, Benjamin; Curio, Gabriel; Muller, Klaus.

In: IEEE Transactions on Biomedical Engineering, Vol. 52, No. 9, 01.09.2005, p. 1541-1548.

Research output: Contribution to journalArticle

Lemm, Steven ; Blankertz, Benjamin ; Curio, Gabriel ; Muller, Klaus. / Spatio-spectral filters for improving the classification of single trial EEG. In: IEEE Transactions on Biomedical Engineering. 2005 ; Vol. 52, No. 9. pp. 1541-1548.
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